Title:
CUTTING DEVICE, AND METHOD FOR MANUFACTURING CUT PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/135862
Kind Code:
A1
Abstract:
This cutting device is supplied with process water from a water supply facility outside of the cutting device. The cutting device comprises a cutting unit, a supply unit, a detection unit, an adjustment unit, and a control unit. The cutting unit cuts an object to be cut. The supply unit supplies, directly or indirectly to at least one of the object to be cut and the cutting unit, the process water supplied from the water supply facility. The detection unit detects a flow rate of the process water supplied by the supply unit. The adjustment unit adjusts the flow rate of the process water supplied by the supply unit. The control unit carries out both the feedforward control for controlling the adjustment unit on the basis of a disturbance factor prior to cutting of the object to be cut, and the feedback control for controlling the adjustment unit on the basis of a detection result by the detection unit, to make the detection result closer to a target value.
Inventors:
HORIMOTO KYOTARO (JP)
KITAGAWA YUDAI (JP)
YOSHIOKA SHO (JP)
KITAGAWA YUDAI (JP)
YOSHIOKA SHO (JP)
Application Number:
PCT/JP2022/034181
Publication Date:
July 20, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B23Q11/10; B24B27/06; B24B55/02; B24B55/06; B28D7/02; G05B11/32; G05D7/06; H01L21/301
Domestic Patent References:
| WO2015030097A1 | 2015-03-05 |
Foreign References:
| JP2016025166A | 2016-02-08 | |||
| JP2004150488A | 2004-05-27 | |||
| JPH07169717A | 1995-07-04 |
Attorney, Agent or Firm:
FUJIWARA Satoshi et al. (JP)
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