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Patent Searching and Data


Title:
CUTTING DEVICE, AND METHOD FOR PRODUCING CUT PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/034171
Kind Code:
A1
Abstract:
This cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held by the table. The imaging device captures an image of the object to be cut held by the table. The object to be cut includes a plurality of marks formed in an imaging area by the imaging device. The cutting device additionally comprises a storage unit and a display unit. The storage unit stores an image and the coordinates of each of a plurality of marks serving as a reference. For each of the plurality of marks imaged by the imaging device, the display unit displays a coordinate shift amount obtained by performing comparison with a corresponding mark among the plurality of marks serving as a reference stored in the storage unit.

Inventors:
FUKUMOTO YOSHITO (JP)
HAYAKAWA ATOMO (JP)
HOSOMI TAKAYA (JP)
KATAOKA SHOICHI (JP)
IMAI ICHIRO (JP)
Application Number:
PCT/JP2023/008552
Publication Date:
February 15, 2024
Filing Date:
March 07, 2023
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
H01L21/301; B23Q17/00; B23Q17/24; B24B27/06; B24B49/12; B28D7/00
Foreign References:
JP2016143861A2016-08-08
JP2021028098A2021-02-25
JP2021000682A2021-01-07
JP2020199618A2020-12-17
JP2004031921A2004-01-29
JP2018133432A2018-08-23
Attorney, Agent or Firm:
FUJIWARA Satoshi et al. (JP)
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