CUTTING DEVICE

WIPO Patent Application WO/2002/081310

A1

A cutting device having a pair of cutting bodies (81c, 82a) to cut the cutting positions at the transverse seal portions (2B) of a packaging bag series combination (21) formed by formation of a series of packaging bags (P) having contents sealed therein by heat-sealing a packaging film (2), wherein the cutting bodies (81c, 82a) comprises a rotary cutting blade (81c) disposed for rotation, and a receiving cutting blade (82a) disposed so as to be opposed to the rotary cutting blade (81c), the receiving cutting blade (82a) being composed of a moving mechanism (83) adapted to advance and retract in synchronism with the rotation of the rotary cutting blade (81c), so that the packaging bag series combination (21) is allowed to be transferred without the bulging portions of their contents (W) contacting the receiving cutting blade (82a). Therefore, it is possible to provide a cutting device that is capable of stably transferring the packaging bag series combination (21) without damaging the film (2). Further, absence of pulsation of the packaging bag series combination (21) due to such contact results in providing a cutting device that is capable of stabilized transfer of the packaging bag series combination (21) and accurate cutting with respect to the cutting positions on the transverse seal portions (2B).

WO/2024/048095	MANAGEMENT SYSTEM
WO/1987/004101	DENSE, FINE-GRAINED TUNGSTEN CARBIDE CERAMICS AND A METHOD FOR MAKING THE SAME

TADA TOSHIO (JP)

PCT/JP2002/001578

October 17, 2002

February 21, 2002

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NIPPON SEIKI CO LTD (JP)
TADA TOSHIO (JP)

B26D3/00; B26D1/36; B26D1/38; B65B61/08; (IPC1-7): B65B61/08; B26D1/36; B26D3/00; B65B9/12

JPH07132916A	1995-05-23
JPS62110103U	1987-07-14
JPH11263304A	1999-09-28

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