CUTTING DEVICE

WIPO Patent Application WO/2023/232020

A1

A cutting device. The cutting device comprises a wire cutting mechanism and a power input mechanism. The wire cutting mechanism comprises a cutting wire (11). The cutting wire (11) is used for cutting a rod body (10). The power input mechanism comprises a power supply (21). One of a positive electrode and a negative electrode of the power supply (21) is connected to one rod body (10), and the other one is connected to another rod body (10) or the cutting wire (11), so that when the cutting wire (11) acts on the rod body (10), the power supply (21), the cutting wire (11) and the rod body (10) can form a discharge loop, so as to perform composite cutting of mechanical cutting and electric spark discharge on the rod body (10). The cutting mode can be improved, the cutting efficiency and the cutting precision of the cutting device are improved, the quality of a cutting surface of a rod body (10) is high, and the requirement for cutting force of a cutting section is low.

JP5769681	Substrate manufacturing method
WO/2013/002061	WAFER FOR SOLAR CELL, SOLAR CELL, AND PRODUCTION METHOD THEREFOR
JPH07304030	INGOT CUTTER

QIU JIAN (CN)
GE RENPENG (CN)
WANG HAICHAO (CN)
LYU JIANZHUANG (CN)
ZOU YINGKUI (CN)
WANG ZHAORUI (CN)

PCT/CN2023/097086

December 07, 2023

May 30, 2023

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QINGDAO GAOCE TECH CO LTD (CN)

B28D5/04; B28D7/00; B28D7/04

CN114872213A	2022-08-09
CN114833955A	2022-08-02
CN114770780A	2022-07-22
CN109773293A	2019-05-21
CN110539413A	2019-12-06
CN110587840A	2019-12-20
CN211074274U	2020-07-24
US20150053650A1	2015-02-26

BEIJING WEIFEI LIANCHUANG INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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