Title:
CUTTING FLUID FOR THIN FINE-WIRE LARGE-SIZE SOLAR-GRADE SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2023/179650
Kind Code:
A1
Abstract:
The present invention relates to the technical field of wire cut machining in photovoltaic industry, and disclosed is a cutting fluid for a thin fine-wire large-size solar-grade silicon wafer. The cutting fluid of the present invention consists of the following components in parts by weight: 25-40 parts of a dispersant, 8-15 parts of a wetting agent, 8-12 parts of a stabilizer, and the remainder being pure water. The total number of parts of the components is 100. The dispersant is a polyether dispersant having a multi-branched structure, can provide more active adsorption sites, and has high dispersion efficiency for silicon powder, and the dispersant has excellent wetting properties; the wetting agent is a structurally symmetric bis-alkynyl alcohol polyether, the wetting properties thereof are more active than those of a common isomeric alcohol ether, and the wetting efficiency is good. According to the present invention, by means of scientific combination of the dispersant and the wetting agent, the cutting fluid has excellent dispersion, dynamic wetting and static wetting, defoaming and other properties, such that the yield of silicon wafers can be effectively improved, and the stability of a cutting process is maintained.
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Inventors:
FU MINGQUAN (CN)
XU ZHIQUN (CN)
SUN BIN (CN)
GAO DA (CN)
GUO XIANG (CN)
MA WEIPING (CN)
BI XIXING (CN)
XU ZHIQUN (CN)
SUN BIN (CN)
GAO DA (CN)
GUO XIANG (CN)
MA WEIPING (CN)
BI XIXING (CN)
Application Number:
PCT/CN2023/083042
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
GOKIN SOLAR CO LTD (CN)
GUANGDONG JINWAN GOKIN SOLAR TECH CO LTD (CN)
GUANGDONG JINWAN GOKIN SOLAR TECH CO LTD (CN)
International Classes:
C10M173/02; C10N30/04; C10N30/06; C10N30/18
Foreign References:
| CN114480009A | 2022-05-13 | |||
| CN113528097A | 2021-10-22 | |||
| CN102827672A | 2012-12-19 | |||
| CN108559609A | 2018-09-21 | |||
| CN113913237A | 2022-01-11 | |||
| KR20120021748A | 2012-03-09 |
Other References:
CHEN, TONGJUN; NIU, SHU-HUAI; ZHAO, QI-QI: "Study on Efficient Silicon Wafer Cutting Fluid TF-033", ZHEJIANG CHEMICAL INDUSTRY, vol. 48, no. 3, 15 March 2017 (2017-03-15), CN , pages 17 - 20, XP009549323, ISSN: 1006-4184
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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