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Title:
CUTTING LINE FORMATION DEVICE AND CUTTING LINE FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/074864
Kind Code:
A1
Abstract:
Provided are a cutting line formation device and formation method with which it is possible to form a highly precise cutting line without employing a complicated large-scale configuration. The present invention provides a cutting line formation device for continuously forming a cutting line extending in the width direction in a long, web-form optical film laminate that includes a long, web-form carrier film and a long, web-form optical film laminated on the carrier film with an adhesive layer interposed therebetween. The cutting line formation device comprises a cutting line formation unit, a transport direction changing unit, and a cutting line detection unit. The cutting line formation unit forms the cutting line in the optical film laminate, which is transported in a horizontal direction from the surface on the side opposite from the carrier film. The transport direction changing unit is positioned on the transport-direction downstream side from the cutting line formation unit, and changes the transport direction of the optical film laminate, after formation of the cutting line, by a prescribed angle. The cutting line detection unit is positioned on the transport-direction downstream side from the transport direction changing unit, and detects the cutting line formed in the optical film laminate.

Inventors:
TSUTSUMI KIYOTAKA (JP)
Application Number:
PCT/JP2021/014914
Publication Date:
April 14, 2022
Filing Date:
April 08, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B26D1/18; B26D3/00; B26D3/08; B26D5/00; B26D5/20; B26D5/34; B65H35/06; G02B5/30; G02F1/1335; G02F1/13363
Foreign References:
JP4418210B22010-02-17
JP2013114227A2013-06-10
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY PSD (JP)
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