Title:
CUTTING METHOD EMPLOYING LASER
Document Type and Number:
WIPO Patent Application WO/2019/061963
Kind Code:
A1
Abstract:
A cutting method employing a laser (11). Before a laser (11) has been used to perform a cutting operation, a heat absorption layer (20) is laid over a cutting path on a substrate to undergo a cutting operation, such that when the laser (11) cuts the substrate (10) along the cutting path on the substrate (10), the heat absorption layer (20) can partially absorb heat of the laser (11), thereby reducing a temperature gradient between a cut section and a non-cut section surrounding the cut section on the substrate (10) during cutting, reducing generation of heat stress and formation of defects, such as cracks, and providing a product of good quality.
Inventors:
YUAN CHAOYU (CN)
Application Number:
PCT/CN2018/073501
Publication Date:
April 04, 2019
Filing Date:
January 19, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
B23K26/06; B23K26/38
Domestic Patent References:
| WO2013186041A1 | 2013-12-19 |
Foreign References:
| CN106064275A | 2016-11-02 | |||
| CN206456047U | 2017-09-01 | |||
| CN105322104A | 2016-02-10 | |||
| CN102176435A | 2011-09-07 | |||
| CN105321840A | 2016-02-10 | |||
| CN103700731A | 2014-04-02 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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