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Patent Searching and Data


Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2012/144299
Kind Code:
A1
Abstract:
[Problem] To provide a cutting tool provided with a coating layer capable of optimizing cutting performance on a cutting face and a major flank. [Solution] A cutting tool (1) provided with a coating layer (6) formed by alternately repeatedly stacking, on a surface of a base (2), A layers (7) made of TiN and B layers (8) made of Ti1-aMa(C1-xNx) (where M is made of at least one selected among the elements in Group 4, 5, 6 metal of the periodic table except Ti, and among Al, Si and Y, and (a) and (x) satisfy 0.1 ≤ a ≤ 0.9 and 0 ≤ x ≤ 1), wherein the ratio (trA/trB) of the thickness of the A layers (7) relative to the B layers (8) in the coating layer (6) on a cutting face (3) is larger than the ratio (tfA/tfB) of the thickness of the A layers (7) relative to the B layers (8) in the coating layer (6) on a major flank (4).

Inventors:
ISHIKAWA KAZUNORI (JP)
Application Number:
PCT/JP2012/057898
Publication Date:
October 26, 2012
Filing Date:
March 27, 2012
Export Citation:
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Assignee:
KYOCERA CORP (JP)
ISHIKAWA KAZUNORI (JP)
International Classes:
B23B27/14
Foreign References:
JP2010188512A2010-09-02
JP2007253271A2007-10-04
JP2008296290A2008-12-11
JP2008264975A2008-11-06
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Claims: