Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2012/147450
Kind Code:
A1
Abstract:
[Problem] To provide a cutting tool wherein a covering layer has excellent adhesion and chipping-resistant characteristics.
[Solution] A cutting tool (1) is provided with: a base body (2), which is composed of a silicon nitride sintered material; and a covering layer (3), wherein a first layer (4), which is composed of TiN having an average crystal width of 0.1-0.4 μm, a second layer (5), which is composed of an Al2O3 layer having an average crystal width of 0.01-1.5 μm, a third layer (6), which is composed of TiN having an average crystal width of 0.01-0.1 μm, which is smaller than the average crystal width of the first layer (4), and a fourth layer (7), which is composed of an Al2O3 layer having an average crystal width of 0.01-1.5 μm, are laminated in this order on the base body (2) surface from the base body (2) side.
More Like This:
| JPS632673 | SUPER ABRASIVE GRAIN TIP FOR TURNING |
| JP2008213059 | HARD COATING |
Inventors:
WATANABE TAKASHI (JP)
Application Number:
PCT/JP2012/058572
Publication Date:
November 01, 2012
Filing Date:
March 30, 2012
Export Citation:
Assignee:
KYOCERA CORP (JP)
WATANABE TAKASHI (JP)
WATANABE TAKASHI (JP)
International Classes:
B23B27/14
Foreign References:
| JP2002284589A | 2002-10-03 | |||
| JPH1015707A | 1998-01-20 | |||
| JPH1071506A | 1998-03-17 | |||
| JP2009154219A | 2009-07-16 | |||
| JP2003213455A | 2003-07-30 | |||
| JPH1015707A | 1998-01-20 |
Other References:
See also references of EP 2703103A4
Download PDF:
Claims: