CUTTING TOOL

WIPO Patent Application WO/2022/264197

A1

A cutting tool provided with a substrate and a coating provided on the substrate, wherein: the coating includes a first layer; the first layer contains multiple crystal grains; the crystal grains comprise AlxTi1-xCyN1-y, where x is greater than 0.65 and less than 0.95 and y is 0 or more and less than 0.1; in a first region comprising a region between a first virtual plane VS1 and a surface S1 of the first layer or a surface-side interface S2 of the first layer, the average aspect ratio of the crystal grains is 3.0 or lower; in a second region comprising a region between a first virtual plane VS1 and a substrate-side interface S3 of the first layer, the average aspect ratio of the crystal grains is greater than 3.0 and 10.0 or less; the first virtual plane VS1 passes a point positioned on the substrate side at a distance of 1 μm apart from the surface S1 or the interface S2 and is parallel to the surface S1 or the interface S2; the crystal grains include crystal grains having a cubic crystal structure; in the first layer, the surface area ratio of the crystal grains having a cubic crystal structure is 90% or higher; the average aspect ratio and the surface area ratio are measured at a cross section along the normal line from the interface between the substrate and the coating; and the thickness of the first layer is 2-20 μm.

PASEUTH ANONGSACK (JP)
KOBAYASHI FUMIYOSHI (JP)
KIDO YASUKI (JP)
TOMINAGA KOSUKE (JP)

PCT/JP2021/022458

December 22, 2022

June 14, 2021

Click for automatic bibliography generation  

SUMITOMO ELECTRIC HARDMETAL CORP (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

B23B27/14

WO2014129530A1	2014-08-28
WO2017175400A1	2017-10-12

JP2002263913A	2002-09-17
JP2017508632A	2017-03-30
JP2014121748A	2014-07-03
JP2020055097A	2020-04-09
JP2013223894A	2013-10-31
JP2016030319A	2016-03-07

FUKAMI PATENT OFFICE, P.C. (JP)

View/Download PDF      PDF Help

Previous Patent: CUTTING TOOL

Next Patent: CUTTING TOOL