Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2023/243008
Kind Code:
A1
Abstract:
Provided is a cutting tool that includes a base material and a coating film provided on the base material. The coating film includes a first layer. The first layer is constituted of a multilayer structure in which a first unit layer and a second unit layer are alternately layered. The thickness of the first unit layer is 2-50 nm. The thickness of the second unit layer is 2-50 nm. The thickness of the first layer is 1.0-20 μm. The first unit layer comprises TiaAlbBcN. The second unit layer comprises TidAleBfN. Here, 0.49 ≤ a ≤ 0.70, 0.19 ≤ b ≤ 0.40, 0.10 < c ≤ 0.20, a+b+c=1.00, 0.39 ≤ d ≤ 0.60, 0.29 ≤ e ≤ 0.50, 0.10 < f ≤ 0.20, d+e+f=1.00, 0.05 ≤ a-d ≤ 0.20, and 0.05 ≤ e-b ≤ 0.20. In the first layer the percentage ratio of the number of titanium atoms relative to the total number of titanium, aluminum and boron atoms is 45% or more.
Inventors:
SUZUKI YUTA (JP)
IMAMURA SHINYA (JP)
IMAMURA SHINYA (JP)
Application Number:
PCT/JP2022/023997
Publication Date:
December 21, 2023
Filing Date:
June 15, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/14; B23B5/16; C23C14/06
Domestic Patent References:
| WO2019181136A1 | 2019-09-26 |
Foreign References:
| JP2007038378A | 2007-02-15 | |||
| JP2011224717A | 2011-11-10 | |||
| JP2011224671A | 2011-11-10 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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