Title:
CYANATE-EPOXY RESIN COMPOSITION, AND PREPREG, METAL FOIL-LAMINATED PLATE AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2000/039216
Kind Code:
A1
Abstract:
A cyanate-epoxy resin composition comprising (A) a cyanate type compound containing two or more cyanato groups in one molecule thereof, (B) an epoxy resin, and (C) a curing accelerator system as main components, wherein the epoxy resin is derived from a dicyclopentadiene-phenol polyaddition product having a cyclopentadiene skeleton and the curing accelerator system comprises both a compound having the function to accelerate the curing reaction of the above (A) and a compound having the function to accelerate the curing reaction of the above (B). The resin composition is excellent in glass transition temperature, dielectric characteristics, heat resistance and the property of low susceptibility to water, and can be effectively used for preparing a prepreg and for manufacturing a laminate, a metal foil-laminated plate and a printed wiring board using the prepreg.
Inventors:
TOMIOKA KENICHI (JP)
TAKANO NOZOMU (JP)
FUKUDA TOMIO (JP)
MIYATAKE MASATO (JP)
MIZUNO YASUYUKI (JP)
TAKANO NOZOMU (JP)
FUKUDA TOMIO (JP)
MIYATAKE MASATO (JP)
MIZUNO YASUYUKI (JP)
Application Number:
PCT/JP1999/007227
Publication Date:
July 06, 2000
Filing Date:
December 22, 1999
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TOMIOKA KENICHI (JP)
TAKANO NOZOMU (JP)
FUKUDA TOMIO (JP)
MIYATAKE MASATO (JP)
MIZUNO YASUYUKI (JP)
TOMIOKA KENICHI (JP)
TAKANO NOZOMU (JP)
FUKUDA TOMIO (JP)
MIYATAKE MASATO (JP)
MIZUNO YASUYUKI (JP)
International Classes:
B32B15/08; C08G59/40; H05K1/03; (IPC1-7): C08L63/04; C08L79/04; C08J5/24; B32B15/08
Foreign References:
| US4533727A | 1985-08-06 | |||
| EP0414461A2 | 1991-02-27 |
Other References:
See also references of EP 1142953A4
Attorney, Agent or Firm:
Asamura, Kiyoshi (Ohtemachi 2-chome Chiyoda-ku Tokyo, JP)
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