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Title:
CYANIC ACID ESTER COMPOUND, RESIN COMPOSITION, CURED OBJECT, SINGLE-LAYER RESIN SHEET, LAYERED RESIN SHEET, PREPREG, METAL-FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/198626
Kind Code:
A1
Abstract:
A cyanic acid ester compound represented by formula (1). (In formula (1), R's each independently represent a hydrogen atom, a linear or branched C1-6 alkyl group, or a halogen atom, and n is an integer of 1-4.)

Inventors:
NAKANISHI KOHEI (JP)
IKEUCHI KOUSUKE (JP)
KATAGIRI SHUNSUKE (JP)
Application Number:
PCT/JP2019/015069
Publication Date:
October 17, 2019
Filing Date:
April 05, 2019
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C07C261/02; B32B15/08; B32B27/18; C08G73/06; C08J5/24; C08L79/04; C09J179/04; H05K1/03; H05K3/46
Domestic Patent References:
WO2015060418A12015-04-30
Foreign References:
JP2011074366A2011-04-14
US5723067A1998-03-03
JP2004256687A2004-09-16
Other References:
AKATSUKA, MASAKI ET AL.: "Development of Epoxy Resins with Controlled High Order Structures Having Excellent Heat Release Properties", IEEJ TRANSACTIONS ON FUNDAMENTALS AND MATERIALS, vol. 123, no. 7, 2003, pages 687 - 692, XP055641937
KOERNER, H. ET AL.: "Probing electric field response of LC thermosets via time-resolved X-ray and dielectric spectroscopy", POLYMER, vol. 52, no. 10, 2011, pages 2206 - 2213, XP028195842, DOI: 10.1016/j.polymer.2011.03.039
MIMURA, KENJI: "High Heat Conduction Composite Material", JOURNAL OF NETWORK POLYMER, JAPAN, vol. 35, no. 2, pages 76 - 83, XP055645093
MORMANN, W. ET AL.: "Anisotropic thermoset networks based on ring-forming monomers (cyanate esters and isocyanates)", MACROMOL. SYMP., vol. 93, no. 1, 1995, pages 97 - 105
NAKAMURA, SACHIKO ET AL.: "Cryogenic Properties of Cyanate Ester Resins", MEETING ABSTRACTS OF THE PHYSICAL SOCIETY OF JAPAN (2016, 1546
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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