Title:
CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/042829
Kind Code:
A1
Abstract:
Provided is a cylindrical grinding device that produces a slicing single crystal by performing cylindrical grinding in which the outer peripheral surface of a grinding single crystal is ground while the grinding single crystal is caused to spin around a spinning axis. The cylindrical grinding device comprises: a posture correction unit that, on the basis of a plane orientation difference between the plane orientation of the grinding single crystal and a target plane orientation of a wafer obtained by slicing the slicing single crystal, performs a spinning process in which the grinding single crystal is caused to spin around the central axis thereof, and a rotation process in which the grinding single crystal is rotated around a rotation axis orthogonal to the central axis, to thereby correct the posture of the grinding single crystal so that the central axis is inclined with respect to the spinning axis; and a grinding unit that performs cylindrical grinding on the outer peripheral surface of the grinding single crystal with the corrected posture while the grinding single crystal is caused to spin around the spinning axis.
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Inventors:
KOHINATA TOMOHITO (JP)
KANEHARA TAKAHIRO (JP)
KANEHARA TAKAHIRO (JP)
Application Number:
PCT/JP2023/022706
Publication Date:
February 29, 2024
Filing Date:
June 20, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B5/50; B24B27/06; B28D5/04
Foreign References:
| JP2017212268A | 2017-11-30 | |||
| JP2000026200A | 2000-01-25 | |||
| JP2011216819A | 2011-10-27 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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