Title:
CYLINDRICAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/177152
Kind Code:
A1
Abstract:
The present invention is configured by spacers (4) being interposed in a gap between a backing tube (3) and a target (2) that has a bending strength of 350 MPa or less, and a bonding part (5) being formed for establishing a bonded state between the target (2) and the backing tube (3). The target (2) is constituted by a plurality of separate targets (2a) lined up in series. Three or more spacers (4) are provided along the length direction of the separate targets (2a) and with an interval in the circumferential direction, in the gap between the separate target(s) (2a) arranged at at least one end and the backing tube (3), the spacers having the length between 0.2 to 0.8 times the length of the separate targets (2a), and the total of the cross-sectional area being between 0.0034 to 0.006 times the cross-sectional area of the gap.
Inventors:
OKANO SHIN (JP)
NISHIMURA KAZUHIRO (JP)
NISHIMURA KAZUHIRO (JP)
Application Number:
PCT/JP2021/007262
Publication Date:
September 10, 2021
Filing Date:
February 26, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34
Domestic Patent References:
| WO2018186385A1 | 2018-10-11 | |||
| WO2014013925A1 | 2014-01-23 |
Foreign References:
| JP2011252237A | 2011-12-15 | |||
| JP2014037619A | 2014-02-27 | |||
| JP2018135590A | 2018-08-30 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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