Title:
DAMPER AND MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024397
Kind Code:
A1
Abstract:
This damper comprises: a substrate; a metal component; a first surface-mounted component disposed on one surface of the substrate; a second surface-mounted component disposed on the other surface of the substrate; and a one-surface-side pad which is provided on the one surface of the substrate and to which one terminal of the first surface-mounted component is bonded. The damper comprises an other-surface-side pad which is provided to the other surface of the substrate and is disposed at a position overlapping the one-surface-side pad in the thickness direction of the substrate, and to which one terminal of the second surface-mounted component is bonded. The damper comprises a conduction means for electrically connecting the one-surface-side pad and the other-surface-side pad and connecting, in series, the one-surface-side pad and the other-surface-side pad.
Inventors:
YAMADA SHUHEI (JP)
MUTO MAKOTO (JP)
SEKI KENICHI (JP)
MUTO MAKOTO (JP)
SEKI KENICHI (JP)
Application Number:
PCT/JP2023/024454
Publication Date:
February 01, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
HIOKI ELECTRIC WORKS (JP)
International Classes:
H05K1/18; G01R19/00; H03H11/24; H05K3/34
Foreign References:
| JP2016195506A | 2016-11-17 | |||
| JP2011155134A | 2011-08-11 | |||
| JP2016225490A | 2016-12-28 | |||
| JPS61136576U | 1986-08-25 | |||
| JPH06310827A | 1994-11-04 | |||
| JP2022518432A | 2022-03-15 | |||
| JPS49145543U | 1974-12-16 |
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
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