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Patent Searching and Data


Title:
DATA COLLECTION AND ANALYSIS SYSTEM, MEASUREMENT DATA COLLECTION UNIT, AND DATA COLLECTION AND ANALYSIS METHOD
Document Type and Number:
WIPO Patent Application WO/2024/047835
Kind Code:
A1
Abstract:
A data collection and analysis system (1) is applied to, for example, an etching device in semiconductor manufacturing. The data collection and analysis system (1) comprises: a measurement data collection unit (100) that is disposed in a wafer chuck in place of an object subjected to plasma processing and that collects measurement data indicating the state of an inspection target member; and a data analysis device (200) that determines the state of the inspection target member on the basis of the collected measurement data. The measurement data collection unit (100) is provided with a support that supports, toward the inspection target member (focus ring, etc.), a measurement unit for measuring the distance to the inspection target member, and rotates the support about the center axis of the inspection target member. The data analysis device (200) determines whether or not the inspection target member has degraded on the basis of the measurement data.

Inventors:
HAYASHI HIDEMATSU (JP)
KUMEKAWA SHIZUO (JP)
FUJIHARA MITSUTERU (JP)
TSUNODA KEISUKE (JP)
Application Number:
PCT/JP2022/032919
Publication Date:
March 07, 2024
Filing Date:
September 01, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/3065
Foreign References:
JP2017138157A2017-08-10
JP2018179728A2018-11-15
JP2017050535A2017-03-09
JP2018032857A2018-03-01
JP2016154224A2016-08-25
JP2021129006A2021-09-02
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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