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Patent Searching and Data


Title:
DC LINK CAPACITOR WITH HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2022/228610
Kind Code:
A3
Abstract:
A DC link capacitor (1) with heat dissipation comprises a lower busbar (2), an upper busbar (4), a cooling structure (5) and a plurality of structurally identical capacitor elements (3) which are arranged between the lower busbar (2) and the upper busbar (4) for making electrical contact. The capacitor elements (3) are each arranged at a distance (31) in a longitudinal direction (30) and at a distance (33) in a transverse direction (32) and are in thermally conductive contact with the cooling structure (5). At least one thermally conductive element (6) defines the cooling structure (5) and is integrally connected to the lower busbar (2) or the upper busbar (4). An outer surface (11) of the lower busbar (2) or of the upper busbar (4) is connected to an active or passive cooling means (10).

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Inventors:
ECKSTEIN DANIEL (DE)
AUGUSTIN PATRICK (DE)
GRAMANN NICOLAI (DE)
Application Number:
PCT/DE2022/100291
Publication Date:
December 22, 2022
Filing Date:
April 14, 2022
Export Citation:
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Assignee:
SCHAEFFLER TECHNOLOGIES AG (DE)
International Classes:
H01G2/08; H01G4/224; H01G4/228; H01G4/236; H01G4/258; H01G4/38; H01G4/40
Foreign References:
US20170133154A12017-05-11
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