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Title:
DECORATIVE MATERIAL FOR FLOORING
Document Type and Number:
WIPO Patent Application WO/2010/104158
Kind Code:
A1
Abstract:
Provided is a decorative material for flooring having a reduced occurrence of curving and warping, even when a lauan substitute with a dimensional change rate greater than 0.02% per percent change in moisture content is used as a wooden base material and a decorative sheet with low permeability is layered on the front surface thereof. Specifically, disclosed is a decorative material for flooring which has a decorative sheet layered on the front surface of a wooden base material and a moisture-resistant film layered on the back surface of the wooden base material, and which is characterised by 1) a wooden base material with a dimensional change rate greater than 0.02% per percent change in moisture content, and 2) a moisture-resistant film with a permeability of no more than 7g/m2·24hrs.

Inventors:
KIMURA KEN (JP)
DOI KOUJI (JP)
NAKAYAMA HIROAKI (JP)
Application Number:
PCT/JP2010/054144
Publication Date:
September 16, 2010
Filing Date:
March 11, 2010
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
KIMURA KEN (JP)
DOI KOUJI (JP)
NAKAYAMA HIROAKI (JP)
International Classes:
E04F15/04; B32B21/08; E04F15/02; E04F15/10; E04F15/18
Foreign References:
JPH11291401A1999-10-26
JP2008238688A2008-10-09
JPH1044113A1998-02-17
JPH09277425A1997-10-28
JPH11264556A1999-09-28
JPH0723141U1995-04-25
JP2003033903A2003-02-04
JP2004174738A2004-06-24
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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