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Title:
DECORATIVE STRUCTURE, HOUSING ASSEMBLY, ELECTRONIC DEVICE, AND OPTOELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/024547
Kind Code:
A1
Abstract:
The present disclosure relates to the field of electronic device structures, aims to solve the problems of low connection reliability and poor sealing effects of decorative structures of existing electronic devices at housing plates, and provides a decorative structure, a housing assembly, an electronic device, and an optoelectronic component. The decorative structure is configured to be mounted to a housing plate of the electronic device, and the housing plate has an outer plate surface and an inner plate surface that are opposite to each other. A mounting plate hole running through the outer plate surface and the inner plate surface is formed on the housing plate. The decorative structure comprises a seat and an exterior decoration. The seat comprises a seat plate and a ring edge connected to the periphery of the seat plate. The exterior decoration comprises a body portion, and the body portion comprises a middle portion and an outer ring portion located at an outer ring of the middle portion. The middle portion and the seat plate are connected to each other at the mounting plate hole. The ring edge and the outer ring portion are spaced apart from each other and define an annular fitting groove to allow a plate body of the housing plate near the periphery of the mounting plate hole to be fitted in the fitting groove. The beneficial effect of the present application is: the decorative structure has high connection reliability and a good sealing effect.

Inventors:
YAN BIN (CN)
XUE KANGLE (CN)
Application Number:
PCT/CN2022/089010
Publication Date:
March 02, 2023
Filing Date:
April 25, 2022
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H04M1/02; H05K5/02
Foreign References:
CN113225453A2021-08-06
CN213186172U2021-05-11
CN107547708A2018-01-05
CN212696068U2021-03-12
KR20130053681A2013-05-24
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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