Title:
DEFECT DETECTION DEVICE AND DEFECT DETECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/239067
Kind Code:
A1
Abstract:
A defect detection device (100) which detects a defect in a semiconductor device (10) and is equipped with a standing wave producer (20) for applying an attractive force to a wire (13) by applying a standing wave (30) to the semiconductor device (10), cameras (41, 42), and a control unit (50) for detecting a defect in the semiconductor device (10) and adjusting operation of the standing wave producer (20), wherein the control unit (50) detects a defect in the semiconductor device (10) by capturing, by using the cameras (41, 42), a first image of the semiconductor device (10) in a first state in which the attractive force is applied to the wire (13), and a second image of the semiconductor device (10) in a second state in which the attractive force which is applied to the wire (13) is smaller than when in the first state, and comparing the first and second images.
Inventors:
MUNAKATA HIROSHI (JP)
ADACHI TAKUYA (JP)
ADACHI TAKUYA (JP)
Application Number:
PCT/JP2021/017711
Publication Date:
November 17, 2022
Filing Date:
May 10, 2021
Export Citation:
Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| JPS55128840A | 1980-10-06 | |||
| JP2016127085A | 2016-07-11 | |||
| JP2020027910A | 2020-02-20 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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