Title:
DEPOSITION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/216801
Kind Code:
A1
Abstract:
The present application relates to the technical field of chip manufacturing, and in particular to a deposition apparatus. The deposition apparatus comprises a vacuum operation table, an operation mechanism, and a plurality of groups of vacuum deposition cavities. The vacuum operation table is provided with a vacuum operation cavity. The plurality of groups of vacuum deposition cavities are communicated with the vacuum operation cavity. The operation mechanism is provided in the vacuum operation cavity. Each group of vacuum deposition cavities are internally provided with deposition devices for depositing a material on the surfaces of wafers. The operation mechanism is used for transferring the wafers deposited with a first material in one group of vacuum deposition cavities into another group of vacuum deposition cavities to continue to deposit a second material, wherein the first material and the second material are the same or different. The deposition apparatus of the present application can prevent a hafnium oxide-based ferroelectric capacitor from being affected by air during a preparation process, thereby ensuring electrical properties of the hafnium oxide-based ferroelectric capacitor.
Inventors:
TAN WANLIANG (CN)
XU JEFFREY JUNHAO (CN)
XU JEFFREY JUNHAO (CN)
Application Number:
PCT/CN2023/088058
Publication Date:
November 16, 2023
Filing Date:
April 13, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/67
Foreign References:
| JP2004055619A | 2004-02-19 | |||
| CN101755330A | 2010-06-23 | |||
| US20080202420A1 | 2008-08-28 | |||
| CN101906608A | 2010-12-08 | |||
| CN102054910A | 2011-05-11 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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