Title:
DEVELOPMENT SOLUTION, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/208313
Kind Code:
A1
Abstract:
Provided are: a development solution which is used on a resist film obtained from an active ray-sensitive or radiation sensitive composition, in order to achieve extremely high-level pattern collapse performance and bridge performance in a high-precision fine pattern, said development solution including a ketone-based or ether-based solvent having branched alkyl groups; a pattern formation method in which said development solution is used; and an electronic device production method including said pattern formation method.
Inventors:
TSUBAKI HIDEAKI (JP)
TSUCHIHASHI TORU (JP)
NIHASHI WATARU (JP)
TSUCHIHASHI TORU (JP)
NIHASHI WATARU (JP)
Application Number:
PCT/JP2016/065354
Publication Date:
December 29, 2016
Filing Date:
May 24, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/32; C08F12/24; G03F7/038; G03F7/039; H01L21/027
Domestic Patent References:
WO2012169620A1 | 2012-12-13 | |||
WO2016104565A1 | 2016-06-30 |
Foreign References:
JP2000199953A | 2000-07-18 | |||
JPS57179839A | 1982-11-05 | |||
JP2003345002A | 2003-12-03 | |||
JPS595245A | 1984-01-12 | |||
JPS5999720A | 1984-06-08 | |||
JPS62108244A | 1987-05-19 | |||
JP2013218223A | 2013-10-24 | |||
JP2012181523A | 2012-09-20 | |||
JP2013041159A | 2013-02-28 | |||
JP2012203238A | 2012-10-22 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
Download PDF: