Title:
DEVICE FOR BONDING THIN BOARD-LIKE MEMBER AND METHOD FOR BONDING THIN BOARD-LIKE MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/001992
Kind Code:
A1
Abstract:
Provided is a device for bonding thin board-like members, said device being capable of eliminating a bonding failure at the time of annularly bonding the thin board-like members to each other by laminating the thin board-like members.
A device (100) for bonding thin board-like members has a holding section (110) and a bonding section (120). The holding section holds one thin-board like member and other thin board-like member in a laminated state. The bonding section bonds to each other at least an annular bonding portion that is provided to the one thin board-like member, and an annular bonding portion that is provided to the other thin board-like member. The holding section is provided with a first holding section and a second holding section. The first holding section holds, in the lamination direction, a first end section of the one thin board-like member, said first end section being positioned along the bonding portion of the one thin board-like member, and a first end section of the other thin board-like member, said first end section being positioned along the bonding portion of the other thin board-like member. The second holding section sandwiches and holds, in the lamination direction, a second end section of the one thin board-like member, said second end section being positioned further toward the inside than the first end section of the one thin board-like member, and a second end section of the other thin board-like member, said second end section being positioned further toward the inside than the first end section of the other thin board-like member.
Inventors:
MORIMIYA NAOYUKI (JP)
MURATA HITOSHI (JP)
SAITO TSUNEO (JP)
TABAYASHI HIROKAZU (JP)
OKAMOTO NAOKI (JP)
YOSHIDA NAOYA (JP)
NISHIMURA KIMIO (JP)
MURATA HITOSHI (JP)
SAITO TSUNEO (JP)
TABAYASHI HIROKAZU (JP)
OKAMOTO NAOKI (JP)
YOSHIDA NAOYA (JP)
NISHIMURA KIMIO (JP)
Application Number:
PCT/JP2014/067446
Publication Date:
January 07, 2016
Filing Date:
June 30, 2014
Export Citation:
Assignee:
NISSAN MOTOR (JP)
International Classes:
B23K26/21; B23K37/04
Foreign References:
| JP2011161450A | 2011-08-25 | |||
| JP2003311838A | 2003-11-06 | |||
| JP2002028796A | 2002-01-29 | |||
| JP2004358528A | 2004-12-24 | |||
| JP2008103210A | 2008-05-01 | |||
| JP2009064593A | 2009-03-26 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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