Title:
DEVICE, ELECTRONIC DEVICE AND METHOD FOR CONNECTING WIRING LINE
Document Type and Number:
WIPO Patent Application WO/2021/075427
Kind Code:
A1
Abstract:
A device according to the present invention is provided with: a stretchable base material; a device main body that is provided on the base material; a wiring line that is provided on the base material; a connection member that is connected to the wiring line; and a conductive bonding layer that is provided between the wiring line and the connection member. The wiring line is provided so as to extend from the conductive bonding layer to the device main body, while having a wiring portion that overlaps with the conductive bonding layer; and the polymerization degree of the conductive bonding layer decreases toward the extending direction of the wiring portion.
Inventors:
KAWAI HIROSHI (JP)
NISHIMURA TAIZO (JP)
SHIMIZU MASAHIKO (JP)
TANAKA TAKAYUKI (JP)
TAKAHASHI NAOHIRO (JP)
NISHIMURA TAIZO (JP)
SHIMIZU MASAHIKO (JP)
TANAKA TAKAYUKI (JP)
TAKAHASHI NAOHIRO (JP)
Application Number:
PCT/JP2020/038638
Publication Date:
April 22, 2021
Filing Date:
October 13, 2020
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H05K1/14; H01B1/20; H01R11/01; H05K3/36
Foreign References:
| JP2003249734A | 2003-09-05 | |||
| JP2012033597A | 2012-02-16 | |||
| JP2017044744A | 2017-03-02 | |||
| JP2016197087A | 2016-11-24 | |||
| JP2019050347A | 2019-03-28 | |||
| US20180154477A1 | 2018-06-07 |
Attorney, Agent or Firm:
SUGIURA, Takuma et al. (JP)
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