Title:
DEVICE FOR HOLDING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2021/184683
Kind Code:
A1
Abstract:
The present invention relates to a device for holding a semiconductor wafer in the process of manufacturing the semiconductor wafer. The device comprises a Bernoulli rod, which is provided with a head and a neck, wherein a plurality of contact pins separated from the Bernoulli rod are arranged on two sides of the head. When a semiconductor wafer is held, the contact pins make contact with the side edge of the semiconductor wafer, thereby limiting the semiconductor wafer, and the positions of the contact pins making contact with the semiconductor wafer are provided with arc-shaped chamfers. In the device for holding a semiconductor wafer of the present invention, the contact pins are separated from the Bernoulli rod, and the arc-shaped chamfers are arranged at the positions of the contact pins making contact with the semiconductor wafer, thereby ensuring that the wafer is stably held, while effectively reducing and avoiding damage of the wafer caused by impact during the holding process.
Inventors:
ZHANG WEN (CN)
Application Number:
PCT/CN2020/111364
Publication Date:
September 23, 2021
Filing Date:
August 26, 2020
Export Citation:
Assignee:
WAFER WORKS EPITAXIAL CORP (CN)
International Classes:
H01L21/683
Foreign References:
| CN207781565U | 2018-08-28 | |||
| CN101496159A | 2009-07-29 | |||
| CN102687262A | 2012-09-19 | |||
| US20160254176A1 | 2016-09-01 | |||
| US20090032060A1 | 2009-02-05 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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