Title:
DEVICE FOR INITIALIZING ELASTIC FILM, POLISHING DEVICE, METHOD FOR INITIALIZING ELASTIC FILM, AND METHOD FOR ASSESSING SERVICE LIFE OF ELASTIC FILM
Document Type and Number:
WIPO Patent Application WO/2023/210073
Kind Code:
A1
Abstract:
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing an elastic film (10) comprises: a pressurizing device (55); an expansion amount detection device (58); and a control device (40) for comparing the expansion amount detected by the expansion amount detection device (58) and a prescribed target expansion amount and, if the expansion amount has reached the target expansion amount, determining that initialization of the elastic film (10) is complete.
Inventors:
SAITO KENICHIRO (JP)
MURATA SEIJI (JP)
TERADA TETSUYA (JP)
ASANO KENTARO (JP)
MURATA SEIJI (JP)
TERADA TETSUYA (JP)
ASANO KENTARO (JP)
Application Number:
PCT/JP2023/001620
Publication Date:
November 02, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/005; B24B37/30; B24B41/06; B24B49/12; H01L21/304
Foreign References:
| JP2018174230A | 2018-11-08 | |||
| JP2017170533A | 2017-09-28 | |||
| JP2015051501A | 2015-03-19 | |||
| JP2015082586A | 2015-04-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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