Title:
DEVICE FOR MACHINING CUTTING PLANE LINE OF GLASS PLATE, AND METHOD FOR MACHINING ON CUTTING PLANE LINE
Document Type and Number:
WIPO Patent Application WO/2013/108472
Kind Code:
A1
Abstract:
The present invention relates to a device for machining a cutting plane line of a glass plate. The device for machining a cutting plane line of a glass plate machines a cutting plane line orthogonal to the conveyance direction on the surface of the glass plate by causing a cutter to travel in a direction sloped at a predetermined angle to the downstream side in the conveyance direction with respect to the direction orthogonal to the conveyance direction of the glass plate, while the glass plate is conveyed in the conveyance direction, the glass plate having a product part in the center area in the direction orthogonal to the conveyance direction and a margin area at the two side areas of the product part, wherein the cutter is provided with a first cutter for machining the cutting plane line to the margin part of the glass plate, and a second cutter for machining the cutting plane line to the product part.
Inventors:
ISHIDA WATARU (JP)
HIRAYAMA HISAO (JP)
HIRAYAMA HISAO (JP)
Application Number:
PCT/JP2012/079301
Publication Date:
July 25, 2013
Filing Date:
November 12, 2012
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03B33/023
Foreign References:
| JP2012096936A | 2012-05-24 | |||
| JPH08231239A | 1996-09-10 | |||
| JP2011153063A | 2011-08-11 | |||
| JPH02221134A | 1990-09-04 | |||
| JPS5020565B1 | 1975-07-16 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims: