Title:
DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR SUCTIONING MEMBER
Document Type and Number:
WIPO Patent Application WO/2024/079975
Kind Code:
A1
Abstract:
This device for manufacturing a semiconductor device (10) comprises a reference jig (40) larger than a semiconductor chip (60), and a mounting tool (15) that individually suctions and transfers the semiconductor chip (60) and the reference jig (40). The mounting tool (15) has: a base surface (26) that contacts the top surface of the reference jig (40) when the reference jig (40) is held by suction; and a second block (22) that protrudes from the base surface (26) and has a suction hole (28) formed therein, the second block (22) contacting the top surface of the semiconductor chip (60) when the semiconductor chip (60) is held by suction. The reference jig (40) has a receiving recess (46) that receives the second block (22) and constitutes a closed space between itself and the mounting tool (15), when held by suction by the mounting tool (15).
Inventors:
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2023/029287
Publication Date:
April 18, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
SHINKAWA LTD (JP)
International Classes:
H01L21/52; H05K13/04
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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