Title:
DEVICE FOR MEASURING GROOVE OF POLISHING PAD FOR CHEMICAL AND MECHANICAL POLISHING AND CHEMICAL AND MECHANICAL POLISHING DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2016/048043
Kind Code:
A1
Abstract:
Disclosed are a device for measuring a groove of a polishing pad for chemical and mechanical polishing (CMP) and a chemical and mechanical polishing device comprising same. The device for measuring a groove and a chemical and mechanical polishing device comprising same of the present invention comprise a device for measuring a groove, the device measuring the wear of a polishing pad (120) by means of measuring the width of a groove and/or the depth of a groove of the polishing pad (120) while the CMP process is being performed or during an idle time when the CMP process is stopped.
Inventors:
KIM KYUNG OK (KR)
KANG YEON HEE (KR)
LEE SEUNG HUN (KR)
KANG YEON HEE (KR)
LEE SEUNG HUN (KR)
Application Number:
PCT/KR2015/010033
Publication Date:
March 31, 2016
Filing Date:
September 23, 2015
Export Citation:
Assignee:
YOUNGCHANG CHEMICAL CO LTD (KR)
International Classes:
H01L21/304; B24B37/20; H01L21/66
Domestic Patent References:
| WO2005072910A1 | 2005-08-11 |
Foreign References:
| JP5226427B2 | 2013-07-03 | |||
| JP2008068338A | 2008-03-27 | |||
| JP2001129754A | 2001-05-15 | |||
| KR20120026455A | 2012-03-19 |
Attorney, Agent or Firm:
HAN, Ji Hee et al. (KR)
한지희 (KR)
한지희 (KR)
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