Title:
DEVICE AND METHOD FOR APPLYING FILAMENTOUS ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2021/200762
Kind Code:
A1
Abstract:
This device for applying a filamentous adhesive feeds out a filamentous adhesive wrapped into a roll together with a separator while pressing the filamentous adhesive against an object. The device for applying a filamentous adhesive comprises a pressing section that presses the filamentous adhesive peeled off from the separator against the object, and the compressive elastic modulus of the separator is 1.5 MPa or less.
Inventors:
TAKASHIMA ATSUSHI (JP)
TARUNO TOMOHIRO (JP)
MORISHITA HIROMITSU (JP)
TARUNO TOMOHIRO (JP)
MORISHITA HIROMITSU (JP)
Application Number:
PCT/JP2021/013146
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B65H37/02; B65H51/00; B65H55/04; C09J7/40
Domestic Patent References:
| WO2016170776A1 | 2016-10-27 |
Foreign References:
| JPH0232801A | 1990-02-02 | |||
| JPS50106874U | 1975-09-02 | |||
| JPS4711910U | 1972-10-12 | |||
| JPH03231980A | 1991-10-15 | |||
| JPS63170492U | 1988-11-07 | |||
| JPS408874B1 | 1965-05-08 | |||
| JPH0476080A | 1992-03-10 | |||
| JPH0585774U | 1993-11-19 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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