Title:
DEVICE AND METHOD FOR FORMING A SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2012/053757
Kind Code:
A2
Abstract:
Disclosed is a device for forming a sealing material using an overmolding method, which is adapted to form a sealing material having a reliable thickness, and particularly, to form a sealing material on a substrate such as a lead frame having a through-hole. The device for forming a sealing material includes: a stationary mold on which a substrate is placed; a movable mold facing the stationary mold; an insert cavity block disposed between the movable mold and the stationary mold; and a resin load space disposed between the insert cavity block and the movable mold. The insert cavity block is provided with forming cavities facing the substrate, and a resin transfer path extending from the resin load space to the forming cavities.
Inventors:
SEUK DAE SU (KR)
PARK EUN SOOK (KR)
CHOI YOUNG GYU (KR)
HWANG DONG JOO (KR)
PARK EUN SOOK (KR)
CHOI YOUNG GYU (KR)
HWANG DONG JOO (KR)
Application Number:
PCT/KR2011/007428
Publication Date:
April 26, 2012
Filing Date:
October 07, 2011
Export Citation:
Assignee:
SHINHAN DIAMOND IND CO LTD (KR)
SEUK DAE SU (KR)
PARK EUN SOOK (KR)
CHOI YOUNG GYU (KR)
HWANG DONG JOO (KR)
SEUK DAE SU (KR)
PARK EUN SOOK (KR)
CHOI YOUNG GYU (KR)
HWANG DONG JOO (KR)
International Classes:
B29C45/14; B29C39/10
Foreign References:
| JP2005191064A | 2005-07-14 | |||
| JP2003133352A | 2003-05-09 | |||
| KR940002440B1 | 1994-03-24 | |||
| JP2000021908A | 2000-01-21 |
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
특허법인 에이아이피 (KR)
특허법인 에이아이피 (KR)
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Claims: