Title:
DEVICE AND METHOD FOR MEASURING CREEP CRACK GROWTH PROPERTIES BY USING SMALL SPECIMEN HAVING FINE GROOVE
Document Type and Number:
WIPO Patent Application WO/2018/212387
Kind Code:
A1
Abstract:
The present invention relates to a device and a method for measuring creep crack growth properties by using a small specimen having a fine groove. According to the present invention, the device for measuring creep crack growth properties comprises: a lower die on which the edge of the specimen is placed and which has a lower die hole formed at the center thereof; an upper die coupled to the upper part of the lower die so as to fix the specimen; and a punching means inserted into the upper die hole formed at the center of an upper die so as to press the upper surface of the specimen, wherein a semi-elliptical fine groove can be machined on the lower surface of the specimen so as to measure the creep crack growth properties.
Inventors:
YOON KEE BONG (KR)
THANH TUAN NGUYEN (KR)
THANH TUAN NGUYEN (KR)
Application Number:
PCT/KR2017/005295
Publication Date:
November 22, 2018
Filing Date:
May 22, 2017
Export Citation:
Assignee:
CHUNGANG UNIV INDUSTRY ACADEMIC COOPERATION FOUNDATION (KR)
International Classes:
G01N3/30; G01N1/28; G01N3/02
Foreign References:
| JP2014077696A | 2014-05-01 | |||
| US6810748B1 | 2004-11-02 | |||
| JP2010014600A | 2010-01-21 | |||
| KR20120010766A | 2012-02-06 | |||
| US6332364B1 | 2001-12-25 |
Attorney, Agent or Firm:
ZENA PATENT LAW FIRM (KR)
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