Title:
DEVICE AND METHOD FOR MOUNTING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/033274
Kind Code:
A1
Abstract:
The present invention relates to a device and method for mounting a component, wherein, in mounting a component on a substrate, a mounting offset is calculated through simulated mounting, and when actually mounting the component, the component is mounted by applying the mounting offset. A device for mounting a component according to one embodiment of the present invention comprises: a head having a nozzle and a substrate recognition camera; a first compensation camera which generates a first image by photographing a component that is suctioned to the nozzle and disposed at a first height; a second compensation camera which generates a second image by photographing a component that is suctioned to the nozzle and disposed at a second height; and a control unit which calculates a mounting offset of the component by comparing the first image and the second image, and controls the head so that the component is mounted on the substrate by reflecting the mounting offset.
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Inventors:
CHOI EUN HO (KR)
Application Number:
PCT/KR2022/002620
Publication Date:
March 09, 2023
Filing Date:
February 23, 2022
Export Citation:
Assignee:
HANWHA PREC MACH CO LTD (KR)
International Classes:
H05K13/08; H05K13/04
Foreign References:
| JPH08189811A | 1996-07-23 | |||
| JP2019012784A | 2019-01-24 | |||
| JP2000174042A | 2000-06-23 | |||
| JP2000068696A | 2000-03-03 | |||
| KR101332005B1 | 2013-11-25 |
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
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