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Title:
DEVICE FOR PERFORMING PLASMA TREATMENT, AND METHOD FOR PERFORMING PLASMA TREATMENT
Document Type and Number:
WIPO Patent Application WO/2024/043104
Kind Code:
A1
Abstract:
Provided is a technology for performing a plasma treatment by supplying a plasma-converted treatment gas to a substrate while preventing the deactivation of a radical in the treatment gas. A device for performing a plasma treatment by supplying a plasma-converted treatment gas to a substrate in a treatment vessel is provided with a shower plate which is arranged between a plasma formation space constituting a plasma formation mechanism for plasma-converting the treatment gas and a substrate treatment space having a mounting table provided therein on the upper side of the mounting table and which has, formed therein, a plurality of treatment gas supply holes through which the plasma-converted treatment gas flows toward the treatment space, in which the mounting table is arranged in the treatment vessel and has the substrate mounted thereon. The device is also provided with a cover gas supply mechanism for supplying a cover gas that flows so as to cover the side wall surfaces of the plurality of treatment gas supply holes in the shower plate.

Inventors:
HAO JIANMING (JP)
Application Number:
PCT/JP2023/029139
Publication Date:
February 29, 2024
Filing Date:
August 09, 2023
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/50; C23C16/455; H01L21/31
Domestic Patent References:
WO2020195980A12020-10-01
Foreign References:
JP2022122171A2022-08-22
JP2008147116A2008-06-26
JP2008066662A2008-03-21
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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