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Title:
DEVICE FOR PLATING CYLINDER BLOCK AND SEALING MECHANISM THEREFOR
Document Type and Number:
WIPO Patent Application WO/2010/026958
Kind Code:
A1
Abstract:
A device for plating a cylinder block for subjecting the cylinder inner peripheral surface of a cylinder of a cylinder block to plating pretreatment or plating treatment by circulating a treatment liquid with one end side of the cylinder inner peripheral surface sealed is provided with a device body that is provided with a workpiece mounting table for mounting the cylinder block thereon, a workpiece holder that is vertically movably provided on the workpiece mounting table, an electrode support member that is provided with an electrode cylinder attached to the device body, a treatment liquid supply member for supplying the treatment liquid to the electrode support member, an electrode that is operated by the electrode cylinder, a sealing jig that is provided at one end of the electrode, a driving mechanism for driving the sealing jig, and a control circuit for controlling the operations of the treatment liquid supply member and the driving mechanism, wherein the electrode and the sealing jig are inserted into the cylinder from the other end side of the cylinder inner peripheral surface, and the driving mechanism is inserted from the one end side of the inner peripheral surface and is able to couple with the sealing jig.

Inventors:
MURAMATSU HITOSHI
KUNIOKA SEIYA
SUDA NAOYUKI
ISHIBASHI AKIRA
ASOU TOMOHIRO
SUZUKI MANABU
OGAWA MASAHIRO
IMAI MINORU
Application Number:
PCT/JP2009/065248
Publication Date:
March 11, 2010
Filing Date:
September 01, 2009
Export Citation:
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Assignee:
SUZUKI MOTOR CORP (JP)
MURAMATSU HITOSHI
KUNIOKA SEIYA
SUDA NAOYUKI
ISHIBASHI AKIRA
ASOU TOMOHIRO
SUZUKI MANABU
OGAWA MASAHIRO
IMAI MINORU
International Classes:
C25D17/00; C25D7/04; C25D17/12
Foreign References:
JPH07118891A1995-05-09
JP2000192287A2000-07-11
Attorney, Agent or Firm:
HATANO, Hisashi et al. (JP)
Hisashi Hatano (JP)
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