Title:
DEVICE FOR POLISHING OUTER PERIPHERAL EDGE OF SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2001/028739
Kind Code:
A1
Abstract:
A device for polishing the outer peripheral edge of a semiconductor wafer, comprising a rotating mechanism (2) for mounting a laminate (1) of semiconductor wafers (4) thereon and rotating them, and a polishing mechanism (3) disposed movable in the radial direction of the rotating mechanism (2), for polishing non-contactingly the outer peripheral edges of the rotating semiconductor wafers (4). An abrasive liquid is introduced into a fine gap (S) formed between the rotating column (10) of the polishing mechanism (3) and the laminate (1) of the wafers (4). The outer peripheral edges of the wafers (4) are polished non-contactingly by abrasive grains contained in the abrasive liquid.
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Inventors:
NAKANO TERUYUKI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
Application Number:
PCT/JP2000/007229
Publication Date:
April 26, 2001
Filing Date:
October 18, 2000
Export Citation:
Assignee:
ISHIIHYOKI KK (JP)
NAKANO TERUYUKI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
NAKANO TERUYUKI (JP)
KOZAWA YASUHIRO (JP)
TAMBO HITOSHI (JP)
International Classes:
B24B55/02; B24B1/00; B24B9/00; B24B9/06; B24B31/00; B24B31/10; B24B37/00; H01L21/304; (IPC1-7): B24B9/00; B24B31/00; B24B37/00; H01L21/304
Foreign References:
| JPH11104942A | 1999-04-20 | |||
| JPH10189510A | 1998-07-21 | |||
| EP0826459A1 | 1998-03-04 | |||
| US5128281A | 1992-07-07 | |||
| JP6104297B2 | 2017-03-29 |
Attorney, Agent or Firm:
Ehara, Syogo (Edobori 1-chome Nishi-ku Osaka-shi, Osaka, JP)
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