DEVICE TEMPERATURE ADJUSTING APPARATUS

WIPO Patent Application WO/2018/055926

A1

A device temperature adjusting apparatus (1) is provided with: a heat absorption section (12) which absorbs heat from a device (BP) subject to temperature adjustment so as to vaporize a liquid phase working fluid; and a heat dissipation section (14) which is arranged further upward than the heat absorption section, and which dissipates heat from a gas phase working fluid so as to condense the same. The device temperature adjusting apparatus is also provided with: an outward path section (18) having formed therein an outward flow channel (182) for guiding working fluid from the heat dissipation section to the heat absorption section; and a return path section (16) having formed therein a return flow channel (162) for guiding working fluid from the heat absorption section to the heat dissipation section. The device temperature adjusting apparatus is further provided with a circulation promotion section (20) for promoting circulation of the working fluid in an annular fluid circulation circuit (10) configured including the heat absorption section, the heat dissipation section, the outward path section, and the return path section. The circulation promotion section is configured so as to cool working fluid flowing through the outward flow channel and/or heat working fluid flowing through the return flow channel.

TAKEUCHI MASAYUKI (JP)
MIURA KOJI (JP)
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
YAMANAKA TAKASHI (JP)
KATO YOSHIKI (JP)

PCT/JP2017/028284

March 29, 2018

August 03, 2017

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DENSO CORP (JP)

F28D15/02; F28D15/06; H01M10/613; H01M10/625; H01M10/633; H01M10/6556; H01M10/6569; H05K7/20

JPS60256764A	1985-12-18
JP2009168273A	2009-07-30
JP2002174492A	2002-06-21
JP2009299478A	2009-12-24
US20030205364A1	2003-11-06

YOU-I PATENT FIRM (JP)

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