CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority under 35 U.S.C. §119 of U.S. Provisional Application Serial No. 63/421735 filed on November 2, 2022, the content of which is relied upon and incorporated herein by reference in its entirety.

BACKGROUND

Field

[0002] The present disclosure relates generally to devices including electrical traces. More particularly, it relates to devices including electrical traces extending from a first side of a substrate to a second side of the substrate opposite to the first side.

Technical Background

[0003] Large tiled displays may be comprised of a plurality of smaller displays arranged adjacent to each other. Each smaller display may include light sources arranged on a first side of the display and a backplane arranged on a second side of the display opposite to the first side. Contacts electrically coupling the light sources to the backplane enable the backplane to supply electrical power and/or control signals to the light sources. For a tiled display to display an acceptable output, the tiles should be substantially continuous. That is, the gap between the light sources should be substantially similar throughout the tiled display, independent of any gap between the tiles.

SUMMARY

[0004] Some embodiments of the present disclosure relate to a device. The device includes a substrate and a plurality of electrical traces. The substrate includes a first surface and a second surface opposite to the first surface and a third surface extending from the first surface to the second surface. The plurality of electrical traces include a foil. Each electrical trace includes a first part extending for a first distance over the first surface, a second part extending over the third surface, and a third part extending for a second distance over the second surface. A portion of each first part is bonded to the first surface and a portion of each third part is bonded to the second surface.

[0005] Yet other embodiments of the present disclosure relate to a method for fabricating electrical traces. The method includes applying a foil sheet over a substrate including a first surface and a second surface opposite to the first surface and a third surface extending from the first surface to the second surface such that a first part of the foil sheet extends for a first distance over the first surface, a second part of the foil sheet extends over the third surface, and a third part of the foil sheet extends for a second distance over the second surface. The method includes laser bonding a portion of the first part to the first surface and laser bonding a portion of the third part to the second surface. The method includes laser patterning the foil sheet to form a plurality of electrical traces such that each electrical trace extends from the first surface to the second surface over the third surface.

[0006] Yet other embodiments of the present disclosure relate to another method for fabricating electrical traces. The method includes patterning a foil sheet to form a patterned foil sheet comprising a plurality of electrical traces and a support structure supporting the plurality of electrical traces. The method includes applying the patterned foil sheet over a substrate including a first surface and a second surface opposite to the first surface and a third surface extending from the first surface to the second surface such that a first part of the patterned foil sheet extends for a first distance over the first surface, a second part of the patterned foil sheet extends over the third surface, and a third part of the patterned foil sheet extends for a second distance over the second surface. The method includes laser bonding a first portion of each of the plurality of electrical traces to the first surface, and laser bonding a second portion of each of the plurality of electrical traces to the second surface. The method includes removing the support structure from the substrate.

[0007] The devices disclosed herein including electrical traces fabricated from a foil and extending from a first surface of a substrate to a second surface of the substrate opposite to the first surface have reduced edge surface quality requirements (e.g., the edges may have an Ra value greater than about 10 micrometers) compared to devices including electrical traces not fabricated from a foil. In addition, the devices disclosed herein may include an edge profile including an about 90 degree non-chamfered edge compared to the specific edge profiles (e.g., modified chamfer/bull nose) used for devices including electrical traces not fabricated from a foil. Further, the resistance of the electrical traces fabricated from a foil may be reduced compared to the resistance of electrical traces not fabricated from a foil. The methods disclosed herein for fabricating the electrical traces from a foil include a reduced number of processing steps (and thus reduced cost) compared to other methods where the electrical traces are not fabricated from a foil.

[0008] Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[0009] It is to be understood that both the foregoing general description and the following detailed description are merely exemplary and are intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiment(s), and together with the description explain principles and operation of the various embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIGS. 1A and IB are various views of an exemplary device including electrical traces;

[0011] FIG. 2 is a cross-sectional view of an exemplary display device;

[0012] FIGS. 3A-3C are cross-sectional views of an exemplary device during various stages of a method for fabricating electrical traces;

[0013] FIGS. 4A-4C are cross-sectional views of another exemplary device during various stages of a method for fabricating electrical traces;

[0014] FIGS. 5A-5E are various views of another exemplary device during various stages of a method for fabricating electrical traces;

[0015] FIG. 6 is a top view of an exemplary device prior to patterning a foil sheet to form electrical traces and exemplary bonding patterns to bond the foil sheet to the substrate;

[0016] FIG. 7 is a perspective view of an exemplary device during patterning of a foil sheet to form electrical traces;

[0017] FIGS. 8A-8K are various views of another exemplary device during various stages of a method for fabricating electrical traces;

[0018] FIG. 9 is a top view of another exemplary device including a patterned foil sheet and cutting lines for further patterning the patterned foil sheet;

[0019] FIG. 10 is a top view of another exemplary device including a patterned foil sheet and cutting lines for further patterning the patterned foil sheet; [0020] FIG. 11 is a cross-sectional view of an exemplary tiled device including two substrates electrically coupled to each other;

[0021] FIG. 12 is a top view of another exemplary tiled device including two substrates electrically isolated from each other;

[0022] FIGS. 13A-13B are flow diagrams of an exemplary method for fabricating electrical traces; and

[0023] FIGS. 14A-14C are flow diagrams of another exemplary method for fabricating electrical traces.

DETAILED DESCRIPTION

[0024] Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0025] Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0026] Directional terms as used herein - for example up, down, right, left, front, back, top, bottom, vertical, horizontal - are made only with reference to the figures as drawn and are not intended to imply absolute orientation.

[0027] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus, specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.

[0028] As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise.

[0029] Metal (e.g., a metal foil) may be bonded to glass by focusing a laser beam at the interface of the glass and metal. Thin metal foils (e.g., having a thickness less than about 50 micrometers) may be bonded to glass by focusing a laser beam on the foil side. An intense interaction melts the region where the laser beam is focused forming a melt pool, which fuses the metal to the glass. The resulting bond is mechanically robust to thermal and humidity cycling. Different metals (e.g., aluminum, gold, silver, copper, steel, etc.) may be bonded to glass. A metal foil to be bonded to glass may have a thickness, for example, within a range between about 0.2 micrometers to about 3 millimeters. In the embodiments described below, laser bonding a metal foil to a surface by focusing a laser beam on an interface between the foil and the surface may, for thin metal foils, be replaced by focusing the laser beam on the foil side.

[0030] Electrical traces may be formed to extend from a first surface of a glass substrate to a second surface of the glass substrate opposite to the first surface using a multistep process that includes multiple passes of non-contact aerosol jetting using an electrically conductive nanoparticle ink. The nanoparticle ink may be atomized utilizing a venturi atomization process and a nitrogen carrier gas. The gas may then be focused into a small deposition stream and deposited onto one side of the glass substrate. The focus height from the gas output tip may be large enough such that when the glass substrate is held at a specified angle, the tip can print on the top surface and edge of the glass substrate. Once the nanoparticle ink is dry, the glass substrate may be flipped over and printing may continue on the other side of the glass substrate to join or create the electrical traces wrapped around the edge of the glass substrate between the first surface and the second surface. The completed part may then undergo a thermal cycle to bond the nanoparticle ink to the surfaces of the glass substrate. This non-contact aerosol jetting process to form the electrical traces includes many process steps that make the process costly, and the resulting resistances of the electrical traces may be high. In contrast, the methods disclosed herein (and the resulting devices) include fewer processing steps that make the disclosed methods less costly, and the resulting resistances of the electrical traces may be lower.

[0031] Referring now to FIGS. 1A and IB, a cross-sectional view and a top view, respectively, of an exemplary device 100 is depicted. Device 100 includes a substrate 102 and a plurality of electrical traces 110. The substrate 102 include a first surface 104, a second surface 106 opposite to the first surface 104, and a third surface 108 extending from the first surface 104 to the second surface 106. In certain exemplary embodiments, the third surface 108 may include a surface roughness Ra value greater than about 0.5 micrometers. In the embodiment illustrated in FIG. 1A, the third surface 108 is perpendicular to the first surface 104 and the second surface 106 and is non-chamfered. In other embodiments, however, the third surface 108 may be chamfered or have another suitable shape. In certain exemplary embodiments, substrate 102 may include a glass substrate including a glass material, such as aluminosilicate, alkali-aluminosilicate, borosilicate, alkali-borosilicate, aluminoborosilicate, alkali-aluminoborosilicate, soda lime, or other suitable glasses. Non-limiting examples of commercially available glasses suitable for use as a glass substrate 102 include EAGLE XG®, Lotus™, Willow®, Iris™, and Gorilla® glasses from Coming Incorporated. The substrate 102 may have a thickness between the first surface 104 and the second surface 106 within a range, for example, from about 0.1 millimeters to about 2 millimeters. The substrate 102 may have a refractive index within a range, for example, between about 1.5 and 2.4.

[0032] The plurality of electrical traces 110 include a foil. In certain exemplary embodiments, the foil may have a thickness within a range between about 5 micrometers and about 20 micrometers. The foil may include aluminum, aluminum alloys, silver, silver alloys, gold, gold alloys, copper, copper alloys, steel and brass alloys, a combination thereof, or another suitable metal or metal alloy having a low resistivity. Each electrical trace 110 includes a first part 112 extending for a first distance 113 (e.g., from the third surface 108) over the first surface 104. Each electrical trace 110 includes a second part 114 extending over the third surface 108. Each electrical trace 110 includes a third part 116 extending for a second distance 117 (e.g., from the third surface 108) over the second surface 106. In some embodiments, the first distance 113 and the second distance 117 are about equal. In other embodiments, the first distance 113 is greater than the second distance 117. In yet other embodiments, the first distance 113 is less than the second distance 117.

[0033] A portion 118 of each first part 112 is bonded to the first surface 104, and a portion 120 of each third part 116 is bonded to the second surface 106. In certain exemplary embodiments, the portion 118 of each first part 112 is laser bonded to the first surface 104, and the portion 120 of each third part 116 is laser bonded to the second surface 106. Each bonded portion 118 and 120 may have a width or diameter less than about 20 micrometers. In certain exemplary embodiments, the spacing (e.g., pitch) between the bonded portions 118 on the first surface 104 and the spacing (e.g., pitch) between the bonded portions 120 on the second surface 106, respectively, may be less than about 100 micrometers (e.g., less than about 50 micrometers) based on the desired electrical properties of the traces (e.g., thickness and conductance) and on the desired density of the electrical traces 110. The distance from the bonded portions 118 and 120 to the third surface 108 may also be less than about 100 micrometers. In some embodiments, portions of each second part 114 may also be laser bonded to the third surface 108.

[0034] As illustrated in FIG. IB, the electrical traces 110 may be electrically isolated from each other and spaced apart from each other. While the electrical traces 110 illustrated in FIG. IB include a uniform size and spacing, in other embodiments, the electrical traces 110 may include different sizes and/or different spacing(s). In addition, the first distances 113 of the first parts 112 and/or the second distances 117 of the third parts 116 may be the same or different among the plurality of electrical traces 110. Further, while the electrical traces 110 illustrated in FIG. IB are arranged parallel to each other, in other embodiments, the electrical traces 110 may have another suitable arrangement, such as a fan-out arrangement.

[0035] FIG. 2 is a cross-sectional view of an exemplary display device 200. A plurality of display devices 200 may be combined to form a tiled display. Display device 200 includes the device 100 including the plurality of electrical traces 110 as previously described and illustrated with reference to FIGS. 1A and IB. In addition, display device 200 includes a plurality of light sources 202 proximate (e.g., on) the first surface 104 of the substrate 102 and a backplane 204 proximate (e.g., on) on the second surface 106 of the substrate 102. The plurality of electrical traces 110 electrically couple the plurality of light sources 202 to the backplane 204 (e.g., via additional electrical traces/contacts on the first surface 104 and/or the second surface 106 of the substrate 102 as will be described below with reference to FIG. 5A). The backplane 204 may supply electrical power and control signals to the plurality of light sources 202 to control the operation of the display device 200.

[0036] Each of the plurality of light sources 202 may, for example, be an LED (e.g., size larger than about 0.5 millimeters), a mini -LED (e.g., size between about 0.1 millimeters and about 0.5 millimeters), a micro-LED (e.g., size smaller than about 0.1 millimeter), an organic LED (OLED), or another suitable light source having a wavelength ranging from about 400 nanometers to about 750 nanometers. In other embodiments, each of the plurality of light sources 202 may have a wavelength shorter than about 400 nanometers and/or longer than about 750 nanometers. The plurality of light sources 202 may be arranged in a 2D array including a plurality of rows and a plurality of columns. The plurality of light sources 202 may also be arranged in other periodic patterns, for example, a hexagonal or triangular lattice, or as quasi-periodic or non-strictly periodic patterns. For example, the spacing between light sources 202 may be smaller at the edges and/or comers of the display device 200. In this case, the distance from the bonded portions 118 to the third surface 108 may be based on a desired pitch of the light sources 202 such that a tiled display formed from a plurality of display devices 200 has a consistent light source pitch across the entire tiled display including between display devices 200. Each light source 202 may be rectangular in shape such that a length of each light source 202 is different from a width of each light source 202. In other embodiments, each light source 202 may have another suitable shape, such as a square shape or a circular shape.

[0037] FIGS. 3A-3C are cross-sectional views of an exemplary device during various stages of a method for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. As illustrated in FIG. 3A at 300a, the method may include applying a foil sheet 310 over a first surface 104 of a substrate 102 such that a first part 312 of the foil sheet 310 extends for a first distance 313 over the first surface 104. A portion of the first part 312 of the foil sheet 310 is then laser bonded to the first surface 104 of the substrate 102 by focusing a laser beam as indicated at 330a on an interface between the first part 312 and the first surface 104. The spot size of the laser may be controlled by adjusting the optics to minimize the bonding width (and thereby maximize the number of electrical traces) while still maintaining the desired mechanical strength. In certain exemplary embodiments, multiple portions of the first part 312 of the foil sheet 310 may be laser bonded to the first surface 104 of the substrate 102. These multiple portions of the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102 may form the bonded portions 118 previously described and illustrated with reference to FIGS. 1A and IB.

[0038] As illustrated in FIG. 3B at 300b, the laser bonding described with reference to FIG. 3 A results in a portion 318 of the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102. With the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102, the method may include applying the foil sheet 310 over the third surface 108 and the second surface 106 of the substrate 102 such that a second part 314 of the foil sheet 310 extends over the third surface 108 and a third part 316 of the foil sheet 310 extends for a second distance 317 over the second surface 106. A portion of the third part 316 of the foil sheet 310 is then laser bonded to the second surface 106 of the substrate 102 by focusing a laser beam as indicated at 330b on an interface between the third part 316 and the second surface 106. In certain exemplary embodiments, multiple portions of the third part 316 of the foil sheet 310 may be laser bonded to the second surface 106 of the substrate 102. These multiple portions of the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102 may form the bonded portions 120 previously described and illustrated with reference to FIGS. 1A and IB.

[0039] As illustrated in FIG. 3C at 300c, the laser bonding described with reference to FIG. 3B results in a portion 320 of the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102. With the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102 and the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102, the method may include laser patterning the foil sheet 310 to form a plurality of electrical traces (e.g., electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB) such that each electrical trace extends from the first surface 104 to the second surface 106 over the third surface 108.

[0040] In the embodiment of FIGS. 3A-3C, the first distance 313 is less than the second distance 317. In this embodiment, laser bonding the first part 312 of the foil sheet 310 to the first surface 104 of the substrate 102 may include focusing, at normal incidence through the second surface 106 and the substrate 102, the laser beam 330a (FIG. 3 A) on the interface between the first part 312 and the first surface 104 to bond the first part 312 to the first surface 104. In addition, laser bonding the third part 316 of the foil sheet 310 to the second surface 106 of the substrate 102 may include focusing, at normal incidence through the first surface 104 and the substrate 102, the laser beam 330b (FIG. 3B) on the interface between the third part 316 and the second surface 106 to bond the third part 316 to the second surface 106. By setting the first distance 313 less than the second distance 317, the laser beam may be focused at normal incidence through the first surface 104 and the substrate 102 to laser bond the third part 316 to the second surface 106 since the first portion 312 will not block the laser beam. In this embodiment, the bonded portion 320 is at a greater distance from the third surface 108 than the bonded portion 318.

[0041] FIGS. 4A-4C are cross-sectional views of another exemplary device during various stages of a method for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. As illustrated in FIG. 4A at 400a, the method includes applying a foil sheet 310 over a first surface 104 of a substrate 102 such that a first part 312 of the foil sheet 310 extends for a first distance 313 over the first surface 104. A portion of the first part 312 of the foil sheet 310 is then laser bonded to the first surface the first part 312 and the first surface 104. In certain exemplary embodiments, multiple portions of the first part 312 of the foil sheet 310 may be laser bonded to the first surface 104 of the substrate 102. These multiple portions of the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102 may form the bonded portions 118 previously described and illustrated with reference to FIGS. 1A and IB.

[0042] As illustrated in FIG. 4B at 400b, the laser bonding described with reference to FIG. 4A results in a portion 318 of the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102. With the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102, the method may include applying the foil sheet 310 over the third surface 108 and the second surface 106 of the substrate 102 such that a second part 314 of the foil sheet 310 extends over the third surface 108 and a third part 316 of the foil sheet 310 extends for a second distance 317 over the second surface 106. A portion of the third part 316 of the foil sheet 310 is then laser bonded to the second surface 106 of the substrate 102 by focusing a laser beam as indicated at 430b on an interface between the third part 316 and the second surface 106. In certain exemplary embodiments, multiple portions of the third part 316 of the foil sheet 310 may be laser bonded to the second surface 106 of the substrate 102. These multiple portions of the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102 may form the bonded portions 120 previously described and illustrated with reference to FIGS. 1A and IB.

[0043] As illustrated in FIG. 4C at 400c, the laser bonding described with reference to FIG. 4B results in a portion 320 of the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102. With the first part 312 of the foil sheet 310 bonded to the first surface 104 of the substrate 102 and the third part 316 of the foil sheet 310 bonded to the second surface 106 of the substrate 102, the method may include laser patterning the foil sheet 310 to form a plurality of electrical traces (e.g., electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB) such that each electrical trace extends from the first surface 104 to the second surface 106 over the third surface 108.

[0044] In the embodiment of FIGS. 4A-4C, the first distance 313 and the second distance 317 are about equal. In this embodiment, laser bonding the first part 312 of the foil sheet 310 to the first surface 104 of the substrate 102 may include focusing, at an oblique incident angle through the second surface 106 and the substrate 102, the laser beam 430a (FIG. 4A) on the interface between the first part 312 and the first surface 104 to bond the first part 312 to the first surface 104. In addition, laser bonding the third part 316 of the foil sheet 310 to the second surface 106 of the substrate 102 may include focusing, at an oblique incident angle through the first surface 104 and the substrate 102, the laser beam 430b (FIG. 4B) on the interface between the third part 316 and the second surface 106 to bond the third part 316 to the second surface 106. With the first distance 313 about equal to the second distance 317, the laser beam may be focused at an oblique incident angle through the first surface 104 and the substrate 102 to laser bond the third part 316 to the second surface 106 since the first portion 312 would block the laser beam if the laser beam was focused at normal incidence. In this embodiment, the bonded portion 320 is at about the same distance from the third surface 108 as the bonded portion 318.

[0045] FIGS. 5A-5E are various views of another exemplary device during various stages of a method for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. As illustrated in the top view of FIG. 5 A at 500a, the method may include forming a plurality of first contact pads 502 on the first surface 104 of a substrate 102. The first contact pads 502 may be electrically coupled to components (e.g., light sources 202 of FIG. 2) on the first surface 104. In certain exemplary embodiments, the first contact pads 502 may include a transparent electrically conductive material, such as indium tin oxide (ITO). In other embodiments, the first contact pads 502 may include an opaque electrically conductive material. The method may also include forming a plurality of second contact pads 504 (illustrated in FIG. 5C) on the second surface 106 of the substrate 102. The plurality of second contact pads 504 may be electrically coupled to a component(s) (e.g., backplane 204 of FIG. 2) on the second surface 106. In certain exemplary embodiments, the second contact pads 504 may include a transparent electrically conductive material, such as ITO or another suitable material. In other embodiments, the second contact pads 504 may include an opaque electrically conductive material.

[0046] As illustrated in the top view of FIG. 5B at 500b and in the cross-sectional view of FIG. 5C at 500c, the method may include applying a foil sheet 310 to the first surface 104 of the substrate 102 such that a first part 312 of the foil sheet 310 extends for a first distance 313 over the first surface 104. With the foil sheet 310 applied to the first surface 104 of the substrate 102, the method may include laser bonding the first part 312 of the foil sheet 310 to each of the plurality of first contact pads 502 to form a plurality of bonded portions 518. As illustrated in FIG. 5C, the first part 312 of the foil sheet 310 are laser bonded to each of the plurality of first contact pads 502 by focusing a laser beam as indicated at 530a on an interface between the first part 312 of the foil sheet 310 and each first contact pad 502. [0047] As illustrated in the cross-sectional view of FIG. 5D at 500d, the laser bonding described with reference to FIGS. 5B and 5C results in portions 518 of the first part 312 of the foil sheet 310 bonded to respective first contact pads 502. With the first part 312 of the foil sheet 310 bonded to each first contact pad 502, the method may include applying the foil sheet 310 over the third surface 108 and the second surface 106 of the substrate 102 such that a second part 314 of the foil sheet 310 extends over the third surface 108 and a third part 316 of the foil sheet 310 extends for a second distance 317 over the second surface 106. The third part 316 of the foil sheet 310 may then be laser bonded to each of the plurality of second contact pads 504 by focusing a laser beam as indicated at 530b on an interface between the third part

316 of the foil sheet 310 and each of the second contact pads 504.

[0048] As illustrated in the cross-sectional view of FIG. 5E at 500e, the laser bonding described with reference to FIG. 5D results in portions 520 of the third part 316 of the foil sheet 310 bonded to respective second contact pads 504. With the first part 312 of the foil sheet 310 bonded to each first contact pad 502 and the third part 316 of the foil sheet 310 bonded to each second contact pad 504, the method may include laser patterning the foil sheet 310 to form a plurality of electrical traces (e.g., electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB) such that each electrical trace electrically couples a first contact pad 502 to a corresponding second contact pad 504.

[0049] In the embodiment of FIGS. 5A-5E, the first distance 313 and the second distance

317 are about equal. In this embodiment, laser bonding the first part 312 of the foil sheet 310 to the first contact pads 502 may include focusing, at normal incidence through the second contact pads 504, the second surface 106, and the substrate 102, the laser beam 530a (FIG. 5C) on the interface between the first part 312 and each first contact pad 502 to form bonded portions 518. In addition, laser bonding the third part 316 of the foil sheet 310 to each second contact pad 504 may include focusing, at an oblique incident angle through the first contact pads 502, the first surface 104, and the substrate 102, the laser beam 530b (FIG. 5D) on the interface between the third part 316 and each second contact pad 504 to form bonded portions 520. In this embodiment, each bonded portion 520 is at about the same distance from the third surface 108 as each bonded portion 518.

[0050] FIG. 6 is a top view of an exemplary device 600 prior to patterning a foil sheet 310 along cutting lines 608 to form electrical traces as indicated at 6101 to 6IO5. Device 600 also includes exemplary bonding patterns to bond the foil sheet 310 to the substrate 102. In certain exemplary embodiments, the foil sheet 310 may be laser bonded to the first surface 104, the second surface 106, and/or the third surface 108 of the substrate 102 (and/or to contact pads formed on the substrate 102) via a dot pattern as indicated at 602 for electrical traces 610 i, 6104, and 6105. In other embodiments, the foil sheet 310 may be laser bonded to first surface 104, the second surface 106, and/or the third surface 108 of the substrate 102 (and/or to contact pads formed on the substrate 102) via a parallel lines pattern, such as parallel lines pattern 604, which extends parallel to the electrical trace 6IO2, or parallel lines pattern 606, which extends perpendicular to the electrical trace 6 IO3. In yet other embodiments, other suitable patterns may be used such as multiple dots per electrical trace, a single line per electrical trace, cross patterns of lines, etc.

[0051] Cutting lines 608 may be arranged in any suitable pattern to form electrical traces 6IO1 to 6IO5 having desired dimensions. For example, the cutting lines 608 may be arranged to form electrical traces having a rectangular shape as illustrated by electrical traces 6IO1 to 6103 or another suitable shape as indicated by electrical traces 6IO4 and 6IO5. After patterning the foil sheet 310 by removing (e.g., ablating, cutting) the portions of the foil sheet 310 along cutting lines 608 using a laser, portions 612i to 6123 of foil sheet 310 that are not part of any electrical trace 6IO1 to 6IO5 may be removed. In certain exemplary embodiments, portions 612i to 6123 of foil sheet 310 may also be removed (e.g., ablated) using a laser. In other embodiments, portions 612i to 6123 of foil sheet 310 may be removed by peeling the portions off the substrate 102.

[0052] FIG. 7 is a perspective view of an exemplary device 700 during patterning of a foil sheet 310 to form electrical traces, such as electrical traces 6IO1 to 6IO5 of FIG. 6. A laser beam 730 may start removing (e.g., ablating, cutting) the foil along a cutting line 608 on the second surface 106 of the substrate 102, transition to removing the foil along the cutting line on the third surface 108 of the substrate 102, and finish removing the foil along the cutting line on the first surface 104 of the substrate 102 as indicated by laser path 732. The laser may then transition to removing the foil along another cutting line 608 and repeating the process until all the electrical traces have been formed.

[0053] In other embodiments, the foil sheet 310 may be replaced by an electrically conductive layer formed using a coating process, such as a screen printing or dip process to coat the edge of the substrate 102 including the third surface 108 and portions of the first surface 104 and the second surface 106. The electrically conductive layer may then be patterned using a laser as previously described above to form the plurality of electrical traces.

[0054] FIGS. 8A-8K are various views of another exemplary device during various stages of a method for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. As illustrated in the cross-sectional view of FIG. 8A at 800a and in the top view of FIG. 8B at 800b, a foil sheet 802 is formed. The foil sheet 802 may be cut from a larger foil sheet or roll to have a desired length and width suitable for forming the desired number of electrical traces. The foil sheet 802 may have a thickness, for example, within a range between about 5 micrometers and about 20 micrometers. The method may include laser patterning the foil sheet 802 as indicated by laser beam 804 (FIG. 8 A) to form a plurality of electrical traces 810 and a support structure 8111 and 81 h supporting the plurality of electrical traces 810 as illustrated in the top view of FIG. 8C at 800c. In other embodiments, the foil sheet 802 may be patterned using another suitable process, such as stamping, photolithography, etc. While four electrical traces 810 are illustrated in FIG. 8C that have similar dimensions, in other embodiments, any suitable number of electrical traces 810 may be formed and the electrical traces may have different dimensions. In addition, while each electrical trace 810 includes a rectangular shape, each electrical trace may include another suitable shape and is not limited to a rectangular shape.

[0055] As illustrated in the top view of FIG. 8D at 800d and in the cross-sectional view of FIG. 8E at 800e, the method may include forming a plurality of first contact pads 502 on a first surface 104 of a substrate 102 and forming a plurality of second contact pads 504 on a second surface 106 of the substrate 102 as previously described and illustrated with reference to FIGS. 5A-5C. The method may further include applying the patterned foil sheet 802 to the first surface 104 of the substrate 102 and to the first contact pads 502 such that a first part 812 of the patterned foil sheet 802 extends for a first distance 813 over (or under) the first surface 104. In the embodiment illustrated in FIG. 8D, the patterned foil sheet 802 may be applied to the first surface 104 by placing the substrate 102 with the first surface 104 facing down on top of the patterned foil sheet 802 and applying pressure to the substrate 102. With the patterned foil sheet 802 applied to the first surface 104, the method may include laser bonding a first portion 818 of each of the plurality of electrical traces 810 to a respective first contact pad 502 by focusing (at a normal incidence or at an oblique incident angle) a laser beam as indicated at 830a through the second contact pads 504, the second surface 106, and the substrate 102 on an interface between each first portion 818 of the plurality of electrical traces 810 and each respective first contact pad 502. While each first portion 818 is illustrated as a circle, in other embodiments, each first portion 818 may include lines or any freeform shape.

[0056] As illustrated in the top view of FIG. 8F at 800f, the method may include removing a first portion 8111 of the support structure from the substrate 102. The substrate 102 with the attached patterned foil sheet 802 may be flipped over. The portions of the patterned foil sheet along cutting line 840i may be removed (e.g., ablated, cut) using a laser as indicated by laser beam 830b. The first portion 81 h of the support structure may then be removed by peeling the first portion 8111 of the support structure off the substrate 102 to form the device 800g as illustrated in the top view of FIG. 8G. In other embodiments, the first portion 8111 of the support structure may be completely removed (e.g., ablated) using the laser.

[0057] As illustrated in the top view of FIG. 8H at 800h, the method may further include applying the patterned foil sheet 802 to the third surface 108 and the second surface 106 of the substrate 102 such that a second part 814 of the patterned foil sheet 802 extends over the third surface 108 and a third part 816 of the patterned foil sheet 802 extends for a second distance 817 over (or under) the second surface 106. In certain exemplary embodiments, the patterned foil sheet 802 may be applied to the second surface 106 by placing the substrate 102 with the second surface 106 facing down on top of the patterned foil sheet 802 and applying pressure to the substrate 102. With the patterned foil sheet 802 applied to the second surface 106, the method may include laser bonding a second portion 820 of each of the plurality of electrical traces 810 to a respective second contact pad 504 by focusing a laser beam as indicated at 830c through the first contact pads 502, the first surface 104, and the substrate 102 on an interface between each second portion 820 of each of the plurality of electrical traces 810 and the respective second contact pad 504. In embodiments where the second distance 817 is about equal to the first distance 813, the laser bonding may include focusing, at an oblique incident angle through the first contact pads 502, the first surface 104, and the substrate 102, a laser beam on the interface between the second portion 820 of each of the plurality of electrical traces 810 and the respective second contact pad 504 to bond the second portion 820 of each of the plurality of electrical traces 810 to the respective second contact pad 504. In embodiments where the second distance 817 is greater than the first distance 813, the laser bonding may include focusing, at normal incidence through the first contact pads 502, the first surface 104, and the substrate 102, a laser beam on the interface between the second portion 820 of each of the plurality of electrical traces 810 and the respective second contact pad 504 to bond the second portion 820 of each of the plurality of electrical traces 810 to the respective second contact pad 504. While each second portion 820 is illustrated as a circle, in other embodiments, each second portion 820 may include lines or any freeform shape.

[0058] As illustrated in the top view of FIG. 81 at 8 OOi, the method may include removing a second portion 81 h of the support structure from the substrate 102. The portions of the patterned foil sheet 802 along cutting line 8402 may be removed (e.g., ablated, cut) using a laser as indicated by laser beam 830d. The second portion 81 h of the support structure may then be removed by peeling the second portion 8112 of the support structure off the substrate 102 to form the device 800j as illustrated in the top view of FIG. 8 J. In other embodiments, the second portion 81 h of the support structure may be completely removed (e.g., ablated) using the laser.

[0059] FIG. 8K is a cross-sectional view of an exemplary device 800k after completing the fabrication of the electrical traces 810. In this embodiment, each electrical trace 810 is bonded to a first contact pad 502 and the first surface 104 of the substrate 102 via a plurality of first portions 818. In addition, each electrical trace 810 is bonded to a second contact pad 504 and the second surface 106 of the substrate 102 via a plurality ofsecond portions 820. Accordingly, each first contact pad 502 on the first surface 104 of the substrate 102 is electrically coupled to a respective second contact pad 504 on the second surface 106 of the substrate 102 via a respective electrical trace 810 extending over the first surface 104, the second surface 106, and the third surface 108 of the substrate 102.

[0060] Since portions of the electrical traces are pre-patterned in the method disclosed with reference to FIGS. 8A-8K, the method may be implemented without complex laser tools for patterning (e.g., trimming) the foil to define the electrical traces on the third surface of the substrate and at the comers between the third surface and the first and second surfaces. The laser may be a pulsed laser, such as a nanosecond pulsed laser, a picosecond pulsed laser, or a femtosecond pulsed laser. The laser pulse energy may, for example, be within a range between about 2.8 microjoules and about 1500 microjoules. The laser wavelength may, for example, be within a range between about 300 nanometers and about 1100 nanometers. The laser repetition rate may, for example, be within a range between about 5 kilohertz and about 1 megahertz. The laser spot size may, for example, be within a range between about 5 micrometers and about 50 micrometers. The oblique angle of incidence of the laser beam relative to the surface of the substrate may be, for example, less than or equal to about 30 degrees for all laser process steps. A normal incident beam may be used if there is an offset between the bonding areas on the first surface and the second surface of the substrate.

[0061] In some embodiments, such as for electrical traces having a width less than about 200 micrometers, a film may be applied to the foil sheet for additional support prior to patterning the foil sheet and applying the patterned foil sheet to the substrate. Once the patterned foil sheet with the attached film has been bonded to the substrate, the film may be removed (e.g., peeled off) leaving the patterned foil sheet on the substrate.

[0062] FIG. 9 is a top view of an exemplary device 900. Device 900 includes a substrate 102, first contact pads 502, a patterned foil sheet 902, and cutting lines 940 for further patterning the patterned foil sheet 902. The patterned foil sheet 902 includes a plurality of electrical traces 910 and a support structure 911. Each electrical trace 910 is bonded to a respective first contact pad 502. With each electrical trace 910 bonded to a respective first contact pad 502, portions of the patterned foil sheet 902 along cutting lines 940 may be removed (e.g., ablated, cut) using a laser to enable removal of the support structure 911 from the substrate 102 and to isolate each of the plurality of electrical traces 910. With the portions of the patterned foil sheet 902 along cutting lines 940 removed, the support structure 911 may be peeled off the substrate 102, which completes the fabrication of the electrical traces 910. In this embodiment, all the cutting lines 940 are adjacent to the contact pads 502, which avoids any risk of damage to the underlying contact pads during the laser process.

[0063] FIG. 10 is a top view of another exemplary device 1000. Device 1000 includes a substrate 102, first contact pads 502, second contact pads 504, a patterned foil sheet 1002, and cutting lines 1040 for further patterning the patterned foil sheet 1002. The patterned foil sheet 1002 includes a plurality of electrical traces 1010 and a support structure 1011. Each electrical trace 1010 is bonded to a respective first contact pad 502 on the first surface 104 of the substrate 102 and a respective second contact pad 504 (via portions 1020) on the second surface 106 of the substrate 102. In this embodiment, the first contact pads 502 are offset with respect to the second contact pads 504. With each electrical trace 1010 bonded to a respective first contact pad 502 and a respective second contact pad 504, portions of the patterned foil sheet 1002 along cutting lines 1040 may be removed (e.g., ablated, cut) using a laser to enable removal of the support structure 1011 from the substrate 102 and to isolate each of the plurality of electrical traces 1010. With the portions of the patterned foil sheet 1002 along cutting lines 1040 removed, the support structure 1011 may be peeled off the substrate 102, which completes the fabrication of the electrical traces 1010. In this embodiment, the pattern of patterned foil sheet 1002 enables bonding of the electrical traces 1010 to the first contact pads 502 by focusing a normal incident laser beam through the second surface 106 of the substrate 102 on the interface between each electrical trace 1010 and the respective first contact pad 502. In addition, the pattern of patterned foil sheet 1002 enables bonding of the electrical traces 1010 to the second contact pads 504 by focusing a normal incident laser beam through the first surface 104 of the substrate 102 on the interface between each electrical trace 1010 and the respective second contact pad 504. Therefore, the use of an oblique incident angle laser beam to bond the electrical traces 1010 to the second contact pads 504 may be avoided. Further, similar to the embodiment of FIG. 9, in this embodiment all the cutting lines 1040 are adjacent to the contact pads 502 and 504, which avoids any risk of damage to the underlying contact pads 502 and 504 during the laser process. [0064] FIG. 11 is a cross-sectional view of an exemplary tiled device 1100 including two devices 100, as previously described and illustrated with reference to FIGS. 1A and IB, electrically coupled to each other. A first device 100a includes a first substrate 102a and first electrical traces 110a. Portions 118a of the first electrical traces 110a are bonded to the first surface 104a of the substrate 102a, and portions 120a of the first electrical traces 110a are bonded to the second surface 106a of the first substrate 102a. A second device 100b includes a second substrate 102b and second electrical traces 110b. Portions 118b of the second electrical traces 110b are bonded to the first surface 104b of the second substrate 102b, and portions 120b of the second electrical traces 110b are bonded to the second surface 106b of the second substrate 102b. The first device 100a and the second device 100b are arranged such that the third surface 108a of the first substrate 102a faces the third surface 108b of the second substrate 102b. Each first electrical trace 110a of the first device 100a is electrically coupled to (e.g., directly contacting) the respective electrical trace 110b of the second device 100b. In this way, a tiled device (e.g., a tiled display) may pass common signals (e.g., power and ground signals) between the tiled devices.

[0065] FIG. 12 is a top view of an exemplary tiled device 1200 including two devices 100, as previously described and illustrated with reference to FIGS. 1A and IB, electrically isolated from each other. A first device 100c includes a first substrate 102c, first contact pads 502c, and first electrical traces 110c. The first device 100c also includes second contact pads on the second surface of the first substrate 102c (not visible in FIG. 12). A portion 118c of each first electrical trace 110c is bonded to a respective first contact pad 502c, and another portion of each first electrical trace 110c is bonded to a respective second contact pad on the second surface of the first substrate 102c. A second device lOOd includes a second substrate 102d, third contact pads 502d, and second electrical traces HOd. The second device lOOd also includes fourth contact pads on the second surface of the second substrate 102d (not visible in FIG. 12). A portion 118d of each second electrical trace 1 lOd is bonded to a respective third contact pad 502d, and another portion of each second electrical trace HOd is bonded to a respective fourth contact pad on the second surface of the second substrate 102d. The first device 100c and the second device lOOd are arranged such that the third surface 108c of the first substrate 102c faces the third surface 108d of the second substrate 102d. The first electrical traces 110c of the first device 100c are electrically isolated from the second electrical traces 11 Od of the second device 1 OOd. For example, the first electrical traces 110c of the first device 100c may be arranged on a first side of the first substrate 102c, while the second electrical traces 1 lOd may be arranged on a second side of the second substrate 102d such that the first electrical traces 110c do not overlap the second electrical traces 1 lOd. In this way, a tiled device (e.g., a tiled display) may be fabricated without passing electrical signals between the tiled devices.

[0066] FIGS. 13A-13B are flow diagrams of an exemplary method 1300 for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. Method 1300 may correspond at least in part to FIGS. 3A-7. As illustrated in FIG. 13A at 1302, method 1300 may include applying a foil sheet (e.g., 310) over a substrate (e.g., 102) comprising a first surface (e.g., 104) and a second surface (e.g., 106) opposite to the first surface and a third surface (e.g., 108) extending from the first surface to the second surface such that a first part (e.g., 312) of the foil sheet extends for a first distance (e.g., 313) over the first surface, a second part (e.g., 314) of the foil sheet extends over the third surface, and a third part (e.g., 316) of the foil sheet extends for a second distance (e.g., 317) over the second surface.

[0067] At 1304, method 1300 may include laser bonding (e.g., 330a, 430a, 530a) a portion (e.g., 318, 518, 602, 604, 606) of the first part to the first surface. At 1306, method 1300 may include laser bonding (e.g., 330b, 430b, 530b) a portion of the third part to the second surface. At 1308, method 1300 may include laser patterning (e.g., 730) the foil sheet to form a plurality of electrical traces (e.g., 110 of FIGS. 1A and IB) such that each electrical trace extends from the first surface to the second surface over the third surface.

[0068] In some embodiments, the first distance and the second distance are about equal. In these embodiments, laser bonding the portion of the first part to the first surface comprises focusing, at an oblique incident angle through the second surface, a laser beam (e.g., 430a) on an interface between the portion of the first part and the first surface . In addition, laser bonding the portion of the third part to the second surface comprises focusing, at an oblique incident angle through the first surface, a laser beam (e.g., 430b) on an interface between the portion of the third part and the second surface.

[0069] In other embodiments, the first distance is less than the second distance. In these embodiments, applying the foil sheet over the substrate, comprises applying the first part over the first surface. Laser bonding the portion of the first part to the first surface comprises focusing, at normal incidence through the second surface, a laser beam (e.g., 330a) on an interface between the portion of the first part and the first surface to bond the portion of the first part to the first surface. With the portion of the first part bonded to the first surface, applying the foil sheet over the substrate further comprises applying the second part over the third surface and the third part over the second surface. Laser bonding the portion of the third part to the second surface comprises focusing, at normal incidence through the first surface, a laser beam (e.g., 330b) on an interface between the portion of the third part and the second surface to bond the portion of the third part to the second surface.

[0070] In some embodiments, laser bonding the portion of the first part to the first surface comprises laser bonding the portion of the first part via at least one of a dot pattern (e.g., 602) and a parallel lines pattern (e.g., 604, 606) such that each of the plurality of electrical traces is bonded to the first surface after laser patterning the foil sheet. Likewise, in some embodiments, laser bonding the portion of the third part to the second surface comprises laser bonding the portion of the third part via at least one of a dot pattern and a parallel lines pattern such that each of the plurality of electrical traces is bonded to the second surface after laser patterning the foil sheet.

[0071] As illustrated in FIG. 13B at 1310, method 1300 may further include forming a plurality of first contact pads (e.g., 502) on the first surface. At 1312, method 1300 may further include forming a plurality of second contact pads (e.g., 504) on the second surface. At 1314, method 1300 may further include wherein laser bonding the portion of the first part to the first surface comprises laser bonding the portion of the first part to the plurality of first contact pads. At 1316, method 1300 may further include wherein laser bonding the portion of the third part to the second surface comprises laser bonding the portion of the third part to the plurality of second contact pads. At 1318, method 1300 may further include wherein after laser patterning the foil sheet, the plurality of first contact pads are electrically coupled to the plurality of second contact pads via the plurality of electrical traces.

[0072] FIGS. 14A-14C are flow diagrams of another exemplary method 1400 for fabricating electrical traces, such as electrical traces 110 previously described and illustrated with reference to FIGS. 1A and IB. Method 1400 may correspond at least in part to FIGS. 8A-8K. As illustrated in FIG. 14A at 1402, method 1400 may include patterning (e.g., laser patterning 804) a foil sheet (e.g., 802) to form a patterned foil sheet comprising a plurality of electrical traces (e.g., 810) and a support structure (e.g., 81 li, 81 h) supporting the plurality of electrical traces. At 1404, method 1400 may include applying the patterned foil sheet over a substrate (e.g., 102) comprising a first surface (e.g., 104) and a second surface (e.g., 106) opposite to the first surface and athird surface (e.g., 108) extending from the first surface to the second surface such that a first part (e.g., 812) of the patterned foil sheet extends for a first distance (e.g., 813) over the first surface, a second part (e.g., 814) of the patterned foil sheet extends over the third surface, and a third part (e.g., 816) of the patterned foil sheet extends for a second distance (e.g., 817) over the second surface. [0073] At 1406, method 1400 may include laser bonding (e.g., 830a) a first portion (e.g., 818) of each of the plurality of electrical traces to the first surface. At 1408, method 1400 may include laser bonding (e.g., 830c) a second portion (e.g., 820) of each of the plurality of electrical traces to the second surface. At 1410, method 1400 may include removing the support structure from the substrate (e.g., FIGS. 8F-8G, 8I-8J).

[0074] In some embodiments, the first distance and the second distance are about equal. In these embodiments, applying the patterned foil sheet over the substrate comprises applying the first part over the first surface. Laser bonding the first portion of each of the plurality of electrical traces to the first surface comprises focusing, at normal incidence through the second surface, a laser beam on an interface between the first portion of each of the plurality of electrical traces and the first surface to bond the first portion of each of the plurality of electrical traces to the first surface. With the first portion of each of the plurality of electrical traces bonded to the first surface, applying the patterned foil sheet over the substrate further comprises applying the second part over the third surface and the third part over the second surface. Laser bonding the second portion of each of the plurality of electrical traces to the second surface comprises focusing, at an oblique incident angle through the first surface, a laser beam on an interface between the second portion of each of the plurality of electrical traces and the second surface to bond the second portion of each of the plurality of electrical traces to the second surface.

[0075] In other embodiments, the first distance is less than the second distance. In this embodiment applying the patterned foil sheet over the substrate comprises applying the first part over the first surface. Laser bonding the first portion of each of the plurality of electrical traces to the first surface comprises focusing, at normal incidence through the second surface, a laser beam on an interface between the first portion of each of the plurality of electrical traces and the first surface to bond the first portion of each of the plurality of electrical traces to the first surface. With the first portion of each of the plurality of electrical traces bonded to the first surface, applying the patterned foil sheet over the substrate further comprises applying the second part over the third surface and the third part over the second surface. Laser bonding the second portion of each of the plurality of electrical traces to the second surface comprises focusing, at normal incidence through the first surface, a laser beam on an interface between the second portion of each of the plurality of electrical traces and the second surface to bond the second portion of each of the plurality of electrical traces to the second surface.

[0076] As illustrated in FIG. 14B at 1412, method 1400 may further include forming a plurality of first contact pads (e.g., 502) on the first surface. At 1414, method 1400 may further include forming a plurality of second contact pads (e.g., 504) on the second surface. At 1416, method 1400 may further include wherein laser bonding the first portion of each of the plurality of electrical traces to the first surface comprises laser bonding the first portion of each of the plurality of electrical traces to a respective first contact pad of the plurality of first contact pads. At 1418, method 1400 may further include wherein laser bonding the second portion of each of the plurality of electrical traces to the second surface comprises laser bonding the second portion of each of the plurality of electrical traces to a respective second contact pad of the plurality of second contact pads. At 1420, method 1400 may further include wherein after removing the support structure from the substrate, the plurality of first contact pads are electrically coupled to the plurality of second contact pads via the plurality of electrical traces. [0077] In some embodiments, forming the plurality of second contact pads on the second surface of the substrate comprises forming the plurality of second contact pads aligned with respect to the plurality of first contact pads (e.g., FIGS. 8D-8K). In other embodiments, forming the plurality of second contact pads on the second surface of the substrate comprises forming the plurality of second contact pads offset with respect to the plurality of first contact pads (e.g., FIG. 10).

[0078] As illustrated in FIG. 14C at 1422, method 1400 may further include laser cutting the patterned foil sheet (e.g., FIGS. 8F, 81, 9, 10) after applying the patterned foil sheet over the substrate and prior to removing the support structure from the substrate to isolate each of the plurality of electrical traces.

[0079] It will be apparent to those skilled in the art that various modifications and variations can be made to embodiments of the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure cover such modifications and variations provided they come within the scope of the appended claims and their equivalents.