DIAMINE COMPOUND, HEAT-RESISTANT RESIN USING SAME, AND RESIN COMPOSITION

WIPO Patent Application WO/2018/087990

A1

The present invention relates to: a novel diamine compound; a heat-resistant resin which uses this diamine compound; and a resin composition which uses this heat-resistant resin. Consequently, the present invention enables the achievement of a cured film that has excellent chemical resistance and film characteristics even in cases where a heat treatment is carried out at such a low temperature as 200°C or less. The novel diamine is represented by general formula (1). A heat-resistant resin or a resin composition according to the present invention is suitable for use in a surface protective film or an interlayer insulating film of a semiconductor device and an insulating layer or a planarization layer of an organic electroluminescent (organic EL) element.

WO/1995/009835	NOVEL PHENYLETHYL AND PHENYLPROPYLAMINES
JP5795619	HCVNS-3 Serine Protease Inhibitor
WO/2010/090031	METHOD FOR PRODUCING OPTICALLY ACTIVE SUCCINIMIDE DERIVATIVE AND INTERMEDIATE THEREOF

MASUDA YUKI (JP)
OKUDA RYOJI (JP)

PCT/JP2017/030746

May 17, 2018

August 28, 2017

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TORAY INDUSTRIES (JP)

C07C237/04; C07C235/24; C08G69/26; C08G73/08; C08G73/10; H01L21/336; H01L23/12; H01L23/29; H01L23/31; H01L27/32; H01L29/786; H01L51/50; H05B33/02; H05B33/12; H05B33/22

WO2016152794A1	2016-09-29
WO2016158674A1	2016-10-06

JPH11199557A	1999-07-27
JP2016117688A	2016-06-30
JP2015168739A	2015-09-28
JP2014181311A	2014-09-29
JP2011197362A	2011-10-06
JP2008224984A	2008-09-25
JP2008106083A	2008-05-08
JPH1124271A	1999-01-29

DATABASE Registry 19 July 2006 (2006-07-19), retrieved from STN Database accession no. 894348-30-2
DATABASE Registry 19 July 2006 (2006-07-19), retrieved from STN Database accession no. 894347-90-1

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