Title:
DIAMOND ABRASIVE RECOVERY METHOD
Document Type and Number:
WIPO Patent Application WO/2014/178280
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a diamond abrasive recovery method which enables a high-purity reclaimed polishing material to be obtained from a polishing material slurry which includes used diamond abrasives. This diamond abrasive recovery method is characterized by involving: a slurry recovery step (S1) in which a polishing material slurry (A) which includes used diamond abrasives is recovered; a separation step (S3) in which an inorganic salt which includes a metal element serving as a divalent or trivalent cation is added to the recovered polishing material slurry (A) (S2) to aggregate the diamond abrasives therein, and the slurry is separated into a dispersion medium (B) which includes the diamond abrasives and a supernatant solution (C); and an extraction step (S7) in which a dispersion medium (F) having a low polarity is used to extract the diamond abrasives from the separated dispersion medium (B) that includes the diamond abrasives.
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Inventors:
NAGAI YUUKI (JP)
MAEZAWA AKIHIRO (JP)
INUI CHIE (JP)
MAEZAWA AKIHIRO (JP)
INUI CHIE (JP)
Application Number:
PCT/JP2014/060782
Publication Date:
November 06, 2014
Filing Date:
April 16, 2014
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B24B57/02; B01D21/01; B03B5/28; C02F1/52
Foreign References:
| JP2009172712A | 2009-08-06 | |||
| JP2002292566A | 2002-10-08 | |||
| JP2003321672A | 2003-11-14 | |||
| JP2008188723A | 2008-08-21 | |||
| JP2008115303A | 2008-05-22 | |||
| JP2000254659A | 2000-09-19 | |||
| JPH1133560A | 1999-02-09 | |||
| JPH1190825A | 1999-04-06 | |||
| JP2010115751A | 2010-05-27 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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