Title:
A DIAMOND ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/101393
Kind Code:
A3
Abstract:
A bonded diamond assembly and a method of forming the assembly. The assembly comprises a polycrystalline diamond wafer having a largest linear dimension of between 25 mm and 200 mm, a substrate and a bonding layer located between the diamond and the substrate and bonding them together. The bonding layer, when inspected using ultrasound using a resolution of 50 µm, a focal length selected to inspect the bonding layer, and frequencies of 100 MHz and 30 MHz, comprises low numbers of voids extending either across the thickness of the bonding layer and low numbers of voids that do not extend across the thickness of the bonding layer.
Inventors:
ELLIS JULIAN JAMES SARGOOD (GB)
MOLLART TIMOTHY PETER (GB)
ZARRIN HOSSEIN (US)
TWITCHEN DANIEL JAMES (GB)
MOLLART TIMOTHY PETER (GB)
ZARRIN HOSSEIN (US)
TWITCHEN DANIEL JAMES (GB)
Application Number:
PCT/EP2021/081488
Publication Date:
August 11, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
ELEMENT SIX TECH LTD (GB)
International Classes:
H01L21/18; H01L21/04
Domestic Patent References:
| WO2016096556A1 | 2016-06-23 |
Foreign References:
| US20190214260A1 | 2019-07-11 | |||
| US20070082467A1 | 2007-04-12 | |||
| CN108597993A | 2018-09-28 |
Attorney, Agent or Firm:
MITCHELL, Matthew Benedict David et al. (GB)
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