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Patent Searching and Data


Title:
DIAPHRAGM FORMING MOLD
Document Type and Number:
WIPO Patent Application WO/2021/134230
Kind Code:
A1
Abstract:
The present application provides a diaphragm forming mold, comprising a cavity for forming a diaphragm; the diaphragm forming mold comprises an upper mold and a lower mold, the upper mold and the lower mold are connected and enclosed to form the cavity for manufacturing the diaphragm, the cavity comprises a main body forming portion and a folding-ring forming portion which is bent and extends from the periphery of the main body forming portion, and the folding-ring forming portion comprises a top forming portion and folding-edge forming portions which are bent and extend from two ends of the top forming portion; and the forming thickness of the top forming portion is greater than the forming thickness of the folding-edge forming portions, so that a diaphragm having a uniform thickness is formed after the top forming portion and the folding-edge forming portions are manufactured. Compared with a traditional mold having the same forming thickness of the top forming portion and the folding-edge forming portions, the forming thickness of the top forming portion of the folding-ring forming portion is greater than the forming thickness of the folding-edge forming portions, and thus after a diaphragm is manufactured, the mold of the present application can solve the problem of uneven forming thickness of the diaphragm caused by shrinkage and deformation of the material, and has better forming quality.

Inventors:
LIANG PING (CN)
ZHAO BIN (CN)
Application Number:
PCT/CN2019/129965
Publication Date:
July 08, 2021
Filing Date:
December 30, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H04R31/00
Domestic Patent References:
WO2013141373A12013-09-26
Foreign References:
CN109803219A2019-05-24
CN109819389A2019-05-28
CN208615244U2019-03-19
CN209273856U2019-08-20
JP2011244295A2011-12-01
Attorney, Agent or Firm:
SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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