Title:
DICING APPARATUS AND DICING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/004365
Kind Code:
A1
Abstract:
A dicing apparatus and a dicing method ensuring high quality dicing by efficiently
removing contamination generated during dicing, thereby eliminating readhesion
to a work. Since a vacuum unit (12) opposing the rotational direction of a blade
(10) and provided with a suction port toward a machining point is provided in the
vicinity of the machining point, cutting fluid scattering toward the rotational
direction is discharged forcibly to the outside of the apparatus, resulting
in high quality dicing where the contamination does not readhere to the work W.
Inventors:
NAKAJIMA TSUTOMU (JP)
Application Number:
PCT/JP2007/057900
Publication Date:
January 10, 2008
Filing Date:
April 10, 2007
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
NAKAJIMA TSUTOMU (JP)
NAKAJIMA TSUTOMU (JP)
International Classes:
H01L21/301; B23Q11/00; B24B55/02; B24B55/06
Foreign References:
| JPH11154654A | 1999-06-08 | |||
| JPH05121541A | 1993-05-18 | |||
| JPH10308366A | 1998-11-17 | |||
| JP2000015622A | 2000-01-18 | |||
| JPS621911U | 1987-01-08 | |||
| JP2006080296A | 2006-03-23 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (P.O. Box 176 Shinjuku Sumitomo Bldg. 39F,6-1, Nishi-shinjuku 2-chom, Shinjuku-ku Tokyo 39, JP)
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