Title:
DICING DIE BONDING FILM PACKING STRUCTURE AND PACKING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/035749
Kind Code:
A1
Abstract:
Rolls (5) are configured from a film (9) wrapped around a hollow core (7). Further, the film (9) is a dicing die bonding film with an unevenly formed surface and similar the film (100) shown in fig. 7. The rolls (5) are inserted into storage bags (11). In the state in which the rolls (5) are inserted into the storage bags (11), side plates (3) are provided on both ends of said rolls (11). Convex sections (19) on the side plates (3) are attached to both ends of the core (7) by fitting into the hollow portion. For the rolls (5) having a pair of side plates (3) attached at the top and bottom ends, the side plates (3) and rolls (5) are fixed by two to four bands (15). The side plates (3) and the rolls (5) are fixed by providing at least two bands (15) intersecting one another and crossing over the entire circumference on the outside of the side plates (3) and the rolls (5) (the storage bags (11)).
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Inventors:
AOYAMA MASAMI (JP)
Application Number:
PCT/JP2012/072637
Publication Date:
March 14, 2013
Filing Date:
September 05, 2012
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
AOYAMA MASAMI (JP)
AOYAMA MASAMI (JP)
International Classes:
B65D77/26; B65D85/672; H01L21/301; H01L21/52
Foreign References:
JP2010163184A | 2010-07-29 | |||
JP2010228805A | 2010-10-14 | |||
JP2010241495A | 2010-10-28 | |||
JP2007161286A | 2007-06-28 |
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Seiichi Inoue (JP)
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Claims:
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