DICING TAPE

WIPO Patent Application WO/2014/061629

A1

Provided is a dicing tape from which a thin semiconductor chip can be efficiently picked up within a short time without the occurrence of chip cracking during a pick-up step after a dicing step. A dicing tape (1) of the present invention has an adhesive layer that contains 0.5-30 parts by mass of a phthalic acid ester per 100 parts by mass of one or more polymers that are selected from the group consisting of acrylic polymers, vinyl acetate polymers and acrylic-based polymers having a carbon-carbon double bond. The adhesive layer has a peel strength of 0.5 N/25 mm or more before radiation curing, while having a peel strength of 0.05-0.4 N/25 mm after radiation curing. If (i) is the peel strength at a peeling rate of 50 mm/min after radiation curing and (ii) is the peel strength at a peeling rate of 1,000 mm/min after radiation curing, (ii)/(i) is 1 or less.

JP5929004	The pressure sensitive adhesive sheet for semiconductor processing
JP7273618	processing equipment
JP2008244007	TAPE FOR DICING AND DICING METHOD

SANO TORU (JP)
YABUKI AKIRA (JP)
TAMAGAWA YURI (JP)
OTA SATOSHI (JP)
AKUTSU AKIRA (JP)
MATSUBARA YUKIHIRO (JP)

PCT/JP2013/077898

April 24, 2014

October 15, 2013

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FURUKAWA ELECTRIC CO LTD (JP)

H01L21/301; C09J7/22; C09J7/38; C09J11/06; C09J131/04; C09J133/00

JP2011089009A	2011-05-06
JP2010260893A	2010-11-18
JP2011228502A	2011-11-10
JP2008060434A	2008-03-13
JP2008021871A	2008-01-31
JP2012164891A	2012-08-30
JP2012164890A	2012-08-30
JP2007294855A	2007-11-08
JPH05235150A	1993-09-10
JP2002373871A	2002-12-26

MATSUSHITA, MAKOTO (JP)
Matsushita 亮 (JP)

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