Title:
DIE-BONDING GLUE AND PHOTOELECTRIC ELEMENT PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/040476
Kind Code:
A1
Abstract:
A die-bonding glue (10), comprising a base body. The refractive index of the die-bonding glue (10) is 1.4 to 2.7. The die-bonding glue (10) is applied to a photoelectric element packaging structure (100). The photoelectric element packaging structure (100) has a better light extraction efficiency.
Inventors:
YOU JUNPING (CN)
Application Number:
PCT/CN2017/070845
Publication Date:
March 08, 2018
Filing Date:
January 11, 2017
Export Citation:
Assignee:
FEICHENG XINLIAN NEW MATERIALS TECH CO LTD (CN)
International Classes:
H01L33/56
Foreign References:
| CN103606616A | 2014-02-26 | |||
| CN202839744U | 2013-03-27 | |||
| CN102482553A | 2012-05-30 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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