Title:
DIE MEASUREMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/061434
Kind Code:
A1
Abstract:
A die measurement apparatus for measuring the height of a punch body and die is provided with a measurement instrument for measuring the distance from a preset punch reference position to the end surface of the punch body, or the distance from a preset die reference position to the end surface of the die. The punch reference position and the die reference position are separately set. By means of the die measurement apparatus, the punch body and die can be easily measured even when the size of the punch body and the size of the die differ greatly.
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Inventors:
IWAMOTO MASAMI (JP)
Application Number:
PCT/JP2013/076556
Publication Date:
April 24, 2014
Filing Date:
September 30, 2013
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D28/34; B21D28/00; B23Q17/00
Foreign References:
| JP2000033537A | 2000-02-02 | |||
| JP2000033536A | 2000-02-02 | |||
| JPH1098283A | 1998-04-14 | |||
| JP2007245165A | 2007-09-27 | |||
| JP2000033565A | 2000-02-02 | |||
| JP2007075947A | 2007-03-29 | |||
| JP2000033536A | 2000-02-02 |
Other References:
See also references of EP 2913116A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
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