DIE AND METHOD OF MANUFACTURING SAME

Title:

DIE AND METHOD OF MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2010/116728

Kind Code:

A1

Abstract:

A die comprising: a base material (12) consisting of glass or plastic; an inorganic base layer (14) formed on the surface of the base material (12); a buffer layer (16)formed on the inorganic base later (14) and containing aluminum; an aluminum layer (18a) formed on the surface of the buffer layer (16); and a porous alumina layer (20) formed on the surface of the aluminum layer (18a). The porous alumina layer (20) comprises recesses (22) each having a two-dimensional size not smaller than 10 nm but not greater than 500 nm when viewed in the direction normal to the surface. The die has excellent adhesion properties between the aluminum layer and the base material.

Inventors:

HAYASHI HIDEKAZU
MINOURA KIYOSHI
ISURUGI AKINOBU

Application Number:

PCT/JP2010/002518

Publication Date:

October 14, 2010

Filing Date:

April 06, 2010

Export Citation:

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Assignee:

SHARP KK (JP)
HAYASHI HIDEKAZU
MINOURA KIYOSHI
ISURUGI AKINOBU

International Classes:

C25D11/04; B29C33/38; B29C33/42; B29C59/02; C25D11/12; G02B1/11; G02B1/118

Domestic Patent References:

WO2006059686A1

2006-06-08

Foreign References:

JP2008075175A	2008-04-03
JP2006028604A	2006-02-02
JP2010090430A	2010-04-22
JP2001517319A	2001-10-02
JP2003531962A	2003-10-28
JP2005156695A	2005-06-16

Other References: