Title:
DIE MONITORING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/188298
Kind Code:
A1
Abstract:
[Problem] To provide a die monitoring device with which it is possible for soiling of an image capturing device caused by mist generated as a result of application of a release agent to be prevented using a simple configuration. [Solution] A die monitoring device 1 comprises a molding die 10 including a moveable die 12 and a fixed die 11, a release agent applying unit 3 which applies a release agent to a die mating surface 11a, 12a of at least one of the moveable die 12 and the fixed die 11, and an image capturing device 31 which acquires a captured image of the die mating surface 11a, 12a of the at least one of the moveable die 12 and the fixed die 11, wherein the temperature of the die mating surface 11a, 12a of the at least one of the moveable die 12 and the fixed die 11 is monitored on the basis of the captured image. The die monitoring device 1 is provided with a suction device 50 having a suction port 51 which is positioned in a region outside an angle of view of the image capturing device 31, and which opens on the generation source side of mist 3a generated as a result of the application of the release agent by the release agent applying unit 3, wherein the suction device 50 sucks the generated mist 3a outside the angle of view.
Inventors:
WATANABE NOBUAKI (JP)
Application Number:
PCT/JP2019/010303
Publication Date:
October 03, 2019
Filing Date:
March 13, 2019
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
B22D17/20; B22C23/02; B29C33/58
Foreign References:
| JP2003001399A | 2003-01-07 | |||
| JP2008209564A | 2008-09-11 | |||
| JPH0528578U | 1993-04-16 | |||
| US20180056382A1 | 2018-03-01 | |||
| JPH04333341A | 1992-11-20 |
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